Category: | Epoxy , Epoxy; Epoxide |
Manufacturer: | Epoxy Technology Inc. |
Trademark: | EPO-TEK® |
Fillers: | - |
Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
Delivery Terms | FOB, CIF, DAP, DAT, DDP |
PDF: | qTnXLO_EPO-TEK-431.pdf ![]() |
PRICE: | Order Products email sales@su-jiao.com |
Message |
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A two component, copper-filled, electrically and thermally conductive epoxy for adhesive bonding in electronics. It may be used at the PCB level for inter-connecting, grounding and EMI RF shielding. Fast curing at relatively low temperatures may be realized. Higher viscosity version of EPO-TEK® 430. |
General Information | |
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Filler / Reinforcement |
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Features |
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Uses |
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Agency Ratings |
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RoHS Compliance |
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Forms |
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Physical | Nominal Value | Unit | |
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Ion Type | |||
Cl- | 15 | ppm | |
K+ | 3 | ppm | |
Na+ | 25 | ppm | |
NH4+ | 36 | ppm | |
Particle Size | < 50.0 | µm |
Additional Information | Nominal Value | Unit | |
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Degradation Temperature | 434 | °C | |
Die Shear Strength - 3.5 kg (23°C) | 8.20 | MPa | |
Operating Temperature | |||
Continuous | -55 to 250 | °C | |
Intermittent | -55 to 350 | °C | |
Storage Modulus (23°C) | 4.82 | GPa | |
Weight Loss on Heating | |||
200°C | 0.76 | % | |
250°C | 1.7 | % | |
300°C | 2.8 | % |
Thermal | Nominal Value | Unit | |
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Glass Transition Temperature 1 | > 110 | °C | |
CLTE - Flow 2 | 5.7E-5 | cm/cm/°C | |
Thermal Conductivity | 1.6 | W/m/K |
Thermoset | Nominal Value | Unit | |
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Thermoset Components | |||
Part A | Mix Ratio by Weight: 100 | ||
Part B | Mix Ratio by Weight: 2.0 | ||
Shelf Life (23°C) | 52 | wk |
Uncured Properties | Nominal Value | Unit | |
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Color | |||
-- 3 | Amber | ||
-- 4 | Brown | ||
Density | |||
Part B | 1.02 | g/cm³ | |
Part A | 3.78 | g/cm³ | |
Viscosity 5(23°C) | > 820 | Pa·s | |
Curing Time (150°C) | 1.0 | hr | |
Pot Life | 180 | min |
Cured Properties | Nominal Value | Unit | |
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Shore Hardness (Shore D) | 77 | ||
Lap Shear Strength (23°C) | 9.27 | MPa | |
Volume Resistivity (23°C) | < 5.0E-3 | ohms·cm |
Note Message | |
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1 . | Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min |
2 . | Below Tg |
3 . | Part B |
4 . | Part A |
5 . | 0.5 rpm |
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