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Golden Compound PP S²PC 3545 BO
| Category: | PP, Unspecified , Polypropylene |
| Manufacturer: | Golden Compound GmbH |
| Trademark: | Golden Compound |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | i0LskQ_Golden-Compound-PP-S-PC-3545-BO.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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Easy flowing PP compound with 35 wt.% natural fibers derived from Sunflower Seed Hulls. Fibers derived from Sunflower Seed Hulls are a side product of Sunflower Oil production. They are GMO free, do not compete with the food chain and do not require additional areal. S² PC has a lower carbon footprint than the materials it is targeted to replace. |
| General Information | |
|---|---|
| Filler / Reinforcement |
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| Features |
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| Processing Method |
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| Physical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Density | 1.02 | g/cm³ | ISO 1183 |
| Melt Volume-Flow Rate (MVR) (190°C/5.0 kg) | 45.0 | cm³/10min | ISO 1133 |
| Molding Shrinkage | ISO 294-4 | ||
| Across Flow | 1.0 | % | |
| Flow | 0.80 | % |
| Mechanical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Tensile Modulus | 2200 | MPa | ISO 527-2 |
| Tensile Stress | 28.0 | MPa | ISO 527-2 |
| Tensile Strain (Break) | 4.6 | % | ISO 527-2 |
| Flexural Modulus | 2100 | MPa | ISO 178 |
| Flexural Stress | 40.0 | MPa | ISO 178 |
| Flexural Strain | 4.5 | % | ISO 178 |
| Impact | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Charpy Notched Impact Strength (23°C) | 3.6 | kJ/m² | ISO 179/1eA |
| Charpy Unnotched Impact Strength (23°C) | 15 | kJ/m² | ISO 179/1eU |
| Thermal | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Heat Deflection Temperature | |||
| 0.45 MPa, Unannealed | 127 | °C | ISO 75-2/B |
| 1.8 MPa, Unannealed | 67.0 | °C | ISO 75-2/A |
| Vicat Softening Temperature | 74.0 | °C | ISO 306/B |
| Injection | Nominal Value | Unit | |
|---|---|---|---|
| Drying Temperature | 80.0 | °C | |
| Drying Time | 4.0 | hr | |
| Suggested Max Moisture | < 0.040 | % | |
| Processing (Melt) Temp | < 190 | °C | |
| Mold Temperature | 20.0 | °C |
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