Category: | PEEK , Polyetheretherketone |
Manufacturer: | Ovation Polymers Inc. |
Trademark: | NEMCON H |
Fillers: | - |
Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
Delivery Terms | FOB, CIF, DAP, DAT, DDP |
PDF: | Xp03MX_NEMCON-H-PA-DP117-X3.pdf ![]() |
PRICE: | Order Products email sales@su-jiao.com |
Message |
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Nemcon™ H-series products are designed for use in high performance electronic assemblies where heat removal is critical to system performance. Nemcon™ H PA DP117/X3 is a thermally conductive polyetheretherketone, offering excellent chemical resistance, good stiffness and high HDT. It should be used in demanding applications where thermal management must be accomplished in harsh environments. |
General Information | |
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Features |
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Uses |
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Forms |
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Physical | Nominal Value | Unit | Test Method |
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Specific Gravity | 1.56 | g/cm³ | ASTM D792 |
Mechanical | Nominal Value | Unit | Test Method |
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Tensile Modulus 1(23°C) | 4630 | MPa | ASTM D638 |
Tensile Strength 2(Break, 23°C) | 42.0 | MPa | ASTM D638 |
Tensile Elongation 3(Break, 23°C) | 1.3 | % | ASTM D638 |
Flexural Modulus 4(23°C, 50.0 mm Span) | 4740 | MPa | ASTM D790 |
Flexural Strength 5(Break, 23°C, 50.0 mm Span) | 90.0 | MPa | ASTM D790 |
Impact | Nominal Value | Unit | Test Method |
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Notched Izod Impact (23°C) | 56 | J/m | ASTM D256 |
Thermal | Nominal Value | Unit | Test Method |
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Deflection Temperature Under Load (1.8 MPa, Unannealed, 3.20 mm) | 125 | °C | ASTM D648 |
Thermal Conductivity (23°C) | 1.3 | W/m/K | ASTM C177 |
Electrical | Nominal Value | Unit | Test Method |
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Surface Resistivity | 6.0E+12 | ohms | ASTM D257 |
Additional Information |
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The value listed as Thermal Conductivity, ASTM C177 was tested in accordance with ASTM E1461. |
Note Message | |
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1 . | 50 mm/min |
2 . | 50 mm/min |
3 . | 50 mm/min |
4 . | 1.3 mm/min |
5 . | 1.3 mm/min |
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