PULSE™ GX50 NAB

Category: PC+ABS , PC/ABS Engineering Resin
Manufacturer: Trinseo
Trademark: PULSE™
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: O5euDX_PULSE-GX50-NAB.pdf
PRICE: ​Order Products​ email   sales@su-jiao.com
Wechat: WECHAT
Message
PULSE GX50 NA is a very low gloss appearance engineering resin which has exceptional impact strength even at low temperatures and has sufficient heat resistance for the majority of automotive interior components. This resin provides excellent flow, has low odor & VOC values and is self colorable. This material has superior low gloss performance over typical PC/ABS.

Applications: PULSE GX50 NAB is used in a wide range of applications where low temperature toughness and tailor made heat resistance is required.
General Information
Features
  • Good Toughness
  • High Flow
  • High Heat Resistance
  • High Impact Resistance
  • Low Gloss
  • Low Temperature Impact Resistance
  • Low to No Odor
  • Low VOC
Uses
  • Automotive Applications
  • Automotive Interior Parts
Forms
  • Pellets
PhysicalNominal ValueUnitTest Method
Density 1.09g/cm³ISO 1183/B
Melt Mass-Flow Rate (MFR) (260°C/5.0 kg)12g/10 minISO 1133
Molding Shrinkage 0.40 to 0.70%ISO 294-4
MechanicalNominal ValueUnitTest Method
Tensile Modulus (23°C)2000MPaISO 527-2
Tensile Stress (Yield, 23°C)43.0MPaISO 527-2
Tensile Strain (Break, 23°C)80%ISO 527-2
ImpactNominal ValueUnitTest Method
Charpy Notched Impact Strength ISO 179/1eA
    -30°C 50kJ/m²
    23°C 50kJ/m²
ThermalNominal ValueUnitTest Method
Heat Deflection Temperature (1.8 MPa, Unannealed)93.0°CISO 75-2/A
Vicat Softening Temperature 109°CISO 306/B50
FlammabilityNominal ValueUnitTest Method
Carbon Emission 10.0µg/gVDA 277
InjectionNominal ValueUnit
Processing (Melt) Temp 255 to 275°C
Mold Temperature 70.0 to 80.0°C
Resin Grade Manufacturer Category Trademark
Telcar® GS2502 Teknor Apex Asia Pacific PTE. LTD. TPE Telcar®
CP PRYME® Nylon 66 NN100STL Chase Plastics Services Inc. Nylon 66 CP PRYME® Nylon 66
HOPELEX AG-3030 Lotte Chemical Corporation PC+ABS HOPELEX
Plaskon 3400-2 Cookson Electronics - Semiconductor Products Epoxy Plaskon
POLYfill PPH FR15030 XNH Polykemi AB PP Homopolymer POLYfill