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EPO-TEK® TV2001
| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | Epoxy Technology Inc. |
| Trademark: | EPO-TEK® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | MEfTIK_EPO-TEK-TV2001.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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A two component, thermally conductive, electrically insulating epoxy designed for low stress semiconductor and electronics packaging. Low Tg, moderate pot-life, snap-curing and very low modulus are a few of its traits. It is particularly suitable for bonding ferrite cores in power device plastic packaging. Excellent adhesion to PCBs, ceramics, most metals and lead-frames. Also available in a frozen syringe. Formerly 300-180-1-4 |
| General Information | |
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| Features |
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| Uses |
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| Agency Ratings |
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| RoHS Compliance |
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| Forms |
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| Physical | Nominal Value | Unit | |
|---|---|---|---|
| Particle Size | < 20.0 | µm |
| Additional Information | Nominal Value | Unit | |
|---|---|---|---|
| Degradation Temperature | 466 | °C | |
| Die Shear Strength - >15 kg (23°C) | 35.2 | MPa | |
| Operating Temperature | |||
| Continuous | -55 to 225 | °C | |
| Intermittent | -55 to 325 | °C | |
| Storage Modulus (23°C) | 112 | MPa | |
| Thixotropic Index | 1.95 | ||
| Weight Loss on Heating | |||
| 200°C | 0.080 | % | |
| 250°C | 0.17 | % | |
| 300°C | 0.35 | % |
| Thermal | Nominal Value | Unit | |
|---|---|---|---|
| Glass Transition Temperature 1 | > 15.0 | °C | |
| CLTE - Flow | |||
| -- 2 | 6.7E-5 | cm/cm/°C | |
| -- 3 | 1.9E-4 | cm/cm/°C | |
| Thermal Conductivity | 0.40 | W/m/K |
| Thermoset | Nominal Value | Unit | |
|---|---|---|---|
| Thermoset Components | |||
| Part A | Mix Ratio by Weight: 100 | ||
| Part B | Mix Ratio by Weight: 6.0 | ||
| Shelf Life (23°C) | 52 | wk |
| Uncured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Color | |||
| -- 4 | White | ||
| -- 5 | Yellow | ||
| Density | |||
| Part B | 0.988 | g/cm³ | |
| Part A | 1.45 | g/cm³ | |
| Viscosity 6(23°C) | 10 to 20 | Pa·s | |
| Pot Life | 2900 | min |
| Cured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Shore Hardness (Shore D) | 45 | ||
| Lap Shear Strength (23°C) | > 13.8 | MPa | |
| Relative Permittivity (1 kHz) | 3.42 | ||
| Volume Resistivity (23°C) | > 8.0E+12 | ohms·cm | |
| Dissipation Factor (1 kHz) | 0.016 |
| Note Message | |
|---|---|
| 1 . | Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min |
| 2 . | Below Tg |
| 3 . | Above Tg |
| 4 . | Part A |
| 5 . | Part B |
| 6 . | 20 rpm |
| Resin Grade | Manufacturer | Category | Trademark |
|---|---|---|---|
| Spartech Polycom SC6-1062U | Spartech Polycom | ASA | Spartech |
| ADDILENE PMD 50272 | ADDIPLAST | PP, Unspecified | ADDILENE |
| APEX® 3201-55NT | Teknor Apex Company | PVC, Flexible | APEX® |
| Arnitel® XG5855 | DSM Engineering Plastics | TPC-ET | Arnitel® |
| CENUSIL® R 150 | Wacker Chemie AG | Silicone | CENUSIL® |
