Category: | Silicone , Silicone |
Manufacturer: | Techsil Limited |
Trademark: | Techsil |
Fillers: | - |
Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
Delivery Terms | FOB, CIF, DAP, DAT, DDP |
PDF: | CpcRiY_Techsil-IS808.pdf ![]() |
PRICE: | Order Products email sales@su-jiao.com |
Message |
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TECHSIL IS808 is a ready-to-use adhesive sealant, which reacts with atmospheric moisture to form a resilient rubber, which remains flexible over a very wide temperature range. TECHSIL IS808 liberates a very small amount of acetic acid during cure which gives rise to the familiar "vinegar" odour, which quickly dissipates after cure. These high specification sealants are ideal for a myriad of engineering applications from production work to fast, effective maintenance and on-the-spot repairs. They are applied directly from the cartridge and cure at room temperature. Under typical ambient conditions they develop a tack free surface in approximately 15 minutes and cure within 24 hours. Key Features:
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General Information | |
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Features |
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Uses |
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Appearance |
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Forms |
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Physical | Nominal Value | Unit | |
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Specific Gravity | 1.05 | g/cm³ | |
Molding Shrinkage - Flow | 0.90 | % |
Hardness | Nominal Value | Unit | |
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Durometer Hardness (Shore A) | 39 |
Elastomers | Nominal Value | Unit | Test Method |
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Tensile Strength 1(Yield) | 2.32 | MPa | |
Tensile Elongation 2(Break) | 280 | % | |
Tear Strength 3 | 5.50 | kN/m | BS 903 |
Thermal | Nominal Value | Unit | |
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CLTE | |||
Flow | 2.9E-4 | cm/cm/°C | |
Transverse | 8.8E-4 | cm/cm/°C | |
Thermal Conductivity | 0.20 | W/m/K | |
Service Temperature 4 | -60 to 250 | °C |
Thermoset | Nominal Value | Unit | |
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Tack Free Time 5(23°C) | 4.0 | min |
Additional Information | Nominal Value | Unit | |
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Cure Time 6(23°C, 3.00 mm) | 7.0 | hr | |
Extrusion Rate | 304 | g/min | |
Young's Modulus 7 | 0.650 | MPa |
Electrical | Nominal Value | Unit | Test Method |
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Surface Resistivity | 7.7E+15 | ohms | ASTM D257 |
Volume Resistivity | 4.7E+14 | ohms·cm | ASTM D257 |
Dielectric Constant (1 MHz) | 3.20 | ASTM D150 | |
Dissipation Factor (1 MHz) | 1.2E-3 | ASTM D150 |
Note Message | |
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1 . | after 7 days cure at 23+/-2°C and 65% relative humidity |
2 . | after 7 days cure at 23+/-2°C and 65% relative humidity |
3 . | after 7 days cure at 23+/-2°C and 65% relative humidity |
4 . | AFS 1540B |
5 . | 65%RH |
6 . | 65%RH |
7 . | after 7 days cure at 23+/-2°C and 65% relative humidity |
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