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KEBAFORM® C 50.0
| Category: | Acetal (POM) Copolymer , Acetal (POM) Copolymer |
| Manufacturer: | BARLOG plastics GmbH |
| Trademark: | KEBAFORM® C |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | 9lVFPt_KEBAFORM-C-50-0.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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| POM Copolymer unreinforced |
| General Information | |
|---|---|
| Resin ID (ISO 1043) |
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| Physical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Density | 1.41 | g/cm³ | ISO 1183 |
| Melt Mass-Flow Rate (MFR) (190°C/2.16 kg) | 5.0 | g/10 min | ISO 1133 |
| Molding Shrinkage | ISO 294-4 | ||
| Across Flow | 2.0 | % | |
| Flow | 2.0 | % |
| Mechanical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Tensile Modulus | 2500 | MPa | ISO 527-2 |
| Tensile Stress (Yield) | 62.0 | MPa | ISO 527-2 |
| Tensile Strain (Yield) | 11 | % | ISO 527-2 |
| Impact | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Charpy Notched Impact Strength (23°C) | 8.0 | kJ/m² | ISO 179/1eA |
| Charpy Unnotched Impact Strength (23°C) | No Break | ISO 179/1eU |
| Thermal | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Heat Deflection Temperature (1.8 MPa, Unannealed) | 110 | °C | ISO 75-2/A |
| Melting Temperature 1 | 166 | °C | ISO 11357-3 |
| Electrical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Surface Resistivity | 1.0E+16 | ohms | IEC 60093 |
| Volume Resistivity | 1.0E+18 | ohms·cm | IEC 60093 |
| Flammability | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Flammability Classification | HB | IEC 60695-11-10, -20 |
| Note Message | |
|---|---|
| 1 . | 10°C/min |
| Resin Grade | Manufacturer | Category | Trademark |
|---|---|---|---|
| REPOL® B120MA | Reliance Industries Limited | PP Impact Copolymer | REPOL® |
| SuperLite® SL550700-100 (3.0mm) | Azdel, Inc. | PP, Unspecified | SuperLite® |
| Xuchuan XCW-8880N | Xuchuan Chemical (Suzhou) Co., Ltd | PUR, Unspecified | Xuchuan |
| Emulprene® 1778R | INSA | SBR, Emulsion | Emulprene® |
| Plaskon CMU-870-2C | Cookson Electronics - Semiconductor Products | Epoxy | Plaskon |
