Category: | PI, TS , Thermoset Polyimide |
Manufacturer: | Epoxy Technology Inc. |
Trademark: | EPO-TEK® |
Fillers: | - |
Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
Delivery Terms | FOB, CIF, DAP, DAT, DDP |
PDF: | 6lsbCq_EPO-TEK-P10.pdf ![]() |
PRICE: | Order Products email sales@su-jiao.com |
Message |
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A single component, modified polyimide, high-temperature grade, silver-filled, electrically and thermally conductive adhesive designed for semiconductor die attach and hybrid microelectronic packaging. |
General Information | |
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Filler / Reinforcement |
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Features |
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Uses |
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Agency Ratings |
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RoHS Compliance |
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Forms |
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Physical | Nominal Value | Unit | |
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Ion Type | |||
Cl- | 224 | ppm | |
K+ | 37 | ppm | |
Na+ | 75 | ppm | |
NH4+ | 28 | ppm | |
Particle Size | < 20.0 | µm |
Additional Information | Nominal Value | Unit | |
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Degradation Temperature | 331 | °C | |
Die Shear Strength - >5 kg (23°C) | 11.7 | MPa | |
Operating Temperature | |||
Continuous | -55 to 200 | °C | |
Intermittent | -55 to 300 | °C | |
Storage Modulus (23°C) | 2.81 | GPa | |
Thixotropic Index | 3.60 | ||
Weight Loss on Heating | |||
200°C | < 0.050 | % | |
250°C | < 0.050 | % | |
300°C | 0.090 | % |
Thermal | Nominal Value | Unit | |
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Glass Transition Temperature 1 | > 100 | °C | |
CLTE - Flow | |||
-- 2 | 3.3E-5 | cm/cm/°C | |
-- 3 | 1.2E-4 | cm/cm/°C | |
Thermal Conductivity | 7.9 | W/m/K |
Thermoset | Nominal Value | Unit | |
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Shelf Life (23°C) | 52 | wk | |
Post Cure Time (285°C) | 1.5 | hr |
Uncured Properties | Nominal Value | Unit | |
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Color | Silver | ||
Density | 2.48 | g/cm³ | |
Viscosity 4(23°C) | 9.0 to 15 | Pa·s | |
Curing Time | |||
80°C 5 | < 0.50 | hr | |
150°C | 1.0 | hr |
Cured Properties | Nominal Value | Unit | |
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Shore Hardness (Shore D) | 73 | ||
Volume Resistivity (23°C) | < 5.0E-3 | ohms·cm |
Note Message | |
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1 . | Ramp 40°C/Min to 300°C |
2 . | Below Tg |
3 . | Above Tg |
4 . | 20 rpm |
5 . | Pre-Bake |
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