EPO-TEK® EJ2189

Category: Epoxy , Epoxy; Epoxide
Manufacturer: Epoxy Technology Inc.
Trademark: EPO-TEK®
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: zMEfhB_EPO-TEK-EJ2189.pdf
PRICE: ​Order Products​ email   sales@su-jiao.com
Wechat: WECHAT
Message
EPO-TEK® EJ2189 is an electrically conductive, silver-filled epoxy paste. This two component system is designed for low temperature curing from ambient to 80 C, although other heat cures can be used.
General Information
Filler / Reinforcement
  • Silver
Features
  • Electrically Conductive
  • Electromagnetic Shielding (EMI)
  • Good Adhesion
  • Radio Frequency Shielding (RFI)
  • Thixotropic
Uses
  • Adhesives
  • Electrical/Electronic Applications
  • LCD Applications
Agency Ratings
  • EC 1907/2006 (REACH)
  • EU 2003/11/EC
  • EU 2006/122/EC
RoHS Compliance
  • RoHS Compliant
Forms
  • Paste
PhysicalNominal ValueUnit
Ion Type
    Cl- 169ppm
    K+ 1ppm
    Na+ 15ppm
    NH4+ 40ppm
Particle Size < 45.0µm
Additional InformationNominal ValueUnit
Degradation Temperature 316°C
Die Shear Strength - >9 kg (23°C) 21.1MPa
Operating Temperature
    Continuous -55 to 160°C
    Intermittent -55 to 260°C
Storage Modulus 1.90GPa
Thixotropic Index 5.20
Weight Loss on Heating
    200°C 0.31%
    250°C 0.65%
    300°C 1.9%
ThermalNominal ValueUnit
Glass Transition Temperature 1> 30.0°C
CLTE - Flow
    -- 25.3E-5cm/cm/°C
    -- 31.1E-4cm/cm/°C
Thermal Conductivity 1.4W/m/K
ThermosetNominal ValueUnit
Thermoset Components
    Part A Mix Ratio by Weight: 10
    Part B Mix Ratio by Weight: 1.0
Shelf Life (23°C)52wk
Uncured PropertiesNominal ValueUnit
Color
    -- 4Amber
    -- 5Silver
Density
    Part B 0.938g/cm³
    Part A 3.42g/cm³
Viscosity 6(23°C)55 to 90Pa·s
Curing Time (150°C)1.0hr
Pot Life 240min
Cured PropertiesNominal ValueUnit
Shore Hardness (Shore D)60
Lap Shear Strength (23°C)10.2MPa
Volume Resistivity
    23°C 7< 5.0E-4ohms·cm
    23°C 8< 5.0E-3ohms·cm
    23°C 9> 7.0E-3ohms·cm
    23°C 10< 9.0E-3ohms·cm
Note Message
1 .Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min
2 .Below Tg
3 .Above Tg
4 .Part B
5 .Part A
6 .1 rpm
7 .150°C/1 hour cure
8 .80°C/3 hours cure
9 .25°C/40-60%RH/3 Day cure
10 .23°C/72 hours cure
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