Perlast® G100XT

Category:	Perfluoroelastomer , Perfluoroelastomer
Manufacturer:	Precision Polymer Engineering Ltd.
Trademark:	Perlast®
Fillers:	-
Ports:	Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms	FOB, CIF, DAP, DAT, DDP
PDF:	zBYIQW_Perlast-G100XT.pdf
PRICE:	Order Products email sales@su-jiao.com

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Message
A visibly clear and highly reinforced perfluoroelastomer, combining ultra- high purity with excellent mechanical properties. Developed for use in advanced wet and dry semiconductor processes down to the 45nm node and beyond, this material has ultra-low out-gassing properties, high temperature stability and excellent plasma resistance to provide effective sealing in extreme conditions. Perlast® G100XT combines a fully fluorinated polymer backbone with a highly fluorinated cross-linking system to provide a material with exceptional resistance to high temperature and aggressive semiconductor processes. The fully organic structure of the material helps to eliminate particles and reduce cost of ownership. The superior chemical performance of the material is enhanced by exceptionally low compression set, high elongation and ultimate tensile strength. Perlast® G100XT has a low modulus, giving it a very high sealing efficiency. The material is highly resistant to stress induced chemical attack in constant compression or constant strain environments, leading to longer service life and reliable sealing performance. Key Attributes Exceptionally pure - does not contain any inorganic fillers which may cause particulation problems. High temperature stability Exceptionally low compression set Excellent mechanical properties Ultra low out-gassing High sealing efficiency Reduced Cost of Ownership (CoO) Typical Applications Static Seals Wafer Handling Products

Message

A visibly clear and highly reinforced perfluoroelastomer, combining ultra- high purity with excellent mechanical properties. Developed for use in advanced wet and dry semiconductor processes down to the 45nm node and beyond, this material has ultra-low out-gassing properties, high temperature stability and excellent plasma resistance to provide effective sealing in extreme conditions.

Perlast® G100XT combines a fully fluorinated polymer backbone with a highly fluorinated cross-linking system to provide a material with exceptional resistance to high temperature and aggressive semiconductor processes. The fully organic structure of the material helps to eliminate particles and reduce cost of ownership. The superior chemical performance of the material is enhanced by exceptionally low compression set, high elongation and ultimate tensile strength.

Perlast® G100XT has a low modulus, giving it a very high sealing efficiency. The material is highly resistant to stress induced chemical attack in constant compression or constant strain environments, leading to longer service life and reliable sealing performance.

Key Attributes

Exceptionally pure - does not contain any inorganic fillers which may cause particulation problems.

High temperature stability

Exceptionally low compression set

Excellent mechanical properties

Ultra low out-gassing

High sealing efficiency

Reduced Cost of Ownership (CoO)

Typical Applications

Static Seals

Wafer Handling Products

General Information
Features	The degassing effect is low to no High purity Low compressive deformability High tensile strength Heat resistance, high Thermal stability, good Extended tensile rate
Uses	Electrical/Electronic Applications Seals
Appearance	Clear/transparent

Hardness	Nominal Value		Test Method
Durometer Hardness (Shore A)	62		ASTM D2240
IRHD Hardness	60 - 70		ASTM D1415, ISO 48

Elastomers	Nominal Value	Unit	Test Method
Tensile Stress (100% Strain)	2.30	MPa	ASTM D412, ISO 37
Tensile Strength (Yield)	16.0	MPa	ASTM D412, ISO 37
Tensile Elongation (Break)	280	%	ASTM D412, ISO 37
Compression Set			ASTM D395, ISO 815
200°C, 22 hr	17	%	ASTM D395, ISO 815
200°C, 70 hr	21	%	ASTM D395, ISO 815

Thermal	Nominal Value	Unit
Maximum Operating Temperature	275	°C

Additional Information
Minimum Operating Temperature: -20°C (-4°F)

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