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EPO-TEK® OE121
| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | Epoxy Technology Inc. |
| Trademark: | EPO-TEK® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | yR8WZ3_EPO-TEK-OE121.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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| A two component, optically clear, low stress, capillary grade semiconductor underfill. It is clear and colorless and capable of curing at low temperatures in the range of 23°C to 80°C, suggested for opto-device flip chip packaging. It can also be used for general potting and encapsulation. |
| General Information | |
|---|---|
| Uses |
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| Agency Ratings |
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| RoHS Compliance |
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| Forms |
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| Processing Method |
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| Physical | Nominal Value | Unit | |
|---|---|---|---|
| Ion Type | |||
| Cl- | 52 | ppm | |
| K+ | 2 | ppm | |
| Na+ | 10 | ppm | |
| NH4+ | 5 | ppm |
| Additional Information | Nominal Value | Unit | |
|---|---|---|---|
| Degradation Temperature | 350 | °C | |
| Die Shear Strength - >15 kg (23°C) | 35.2 | MPa | |
| Operating Temperature | |||
| Continuous | -55 to 200 | °C | |
| Intermittent | -55 to 275 | °C | |
| Storage Modulus (23°C) | 1.71 | GPa | |
| Weight Loss on Heating | |||
| 200°C | 1.2 | % | |
| 250°C | 1.7 | % | |
| 300°C | 3.9 | % |
| Thermal | Nominal Value | Unit | |
|---|---|---|---|
| Glass Transition Temperature 1 | > 55.0 | °C | |
| CLTE - Flow | |||
| -- 2 | 4.3E-5 | cm/cm/°C | |
| -- 3 | 1.6E-4 | cm/cm/°C |
| Optical | Nominal Value | Unit | |
|---|---|---|---|
| Refractive Index | 1.527 | ||
| Transmittance (380 to 1640 nm) | > 94.0 | % |
| Thermoset | Nominal Value | Unit | |
|---|---|---|---|
| Thermoset Components | |||
| Part A | Mix Ratio by Weight: 100 | ||
| Part B | Mix Ratio by Weight: 35 | ||
| Shelf Life (23°C) | 52 | wk |
| Uncured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Color | |||
| -- 4 | Clear/Transparent | ||
| -- 5 | Transparent, Light Yellow | ||
| Density | |||
| Part B | 0.958 | g/cm³ | |
| Part A | 1.16 | g/cm³ | |
| Viscosity 6(23°C) | 0.30 to 0.50 | Pa·s | |
| Curing Time (90°C) | > 1.0 | hr | |
| Pot Life | 300 | min |
| Cured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Shore Hardness (Shore D) | 78 | ||
| Lap Shear Strength (23°C) | 11.8 | MPa | |
| Relative Permittivity (1 kHz) | 3.52 | ||
| Volume Resistivity (23°C) | > 1.0E+13 | ohms·cm | |
| Dissipation Factor (1 kHz) | 9.0E-3 |
| Note Message | |
|---|---|
| 1 . | Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min |
| 2 . | Below Tg |
| 3 . | Above Tg |
| 4 . | Part B |
| 5 . | Part A |
| 6 . | 100 rpm |
| Resin Grade | Manufacturer | Category | Trademark |
|---|---|---|---|
| Maxxam™ FR PP301 SHI NC196 | PolyOne Corporation | PP, Unspecified | Maxxam™ FR |
| RTP 4002 A | RTP Company | PPA | RTP |
| SILVER® SA-5206 | Guangdong Silver Age Sci & Tech. Co., Ltd | TPE | SILVER® |
| Baytec® WP-260 | Covestro - PUR | PUR-Ether/MDI | Baytec® |
| DURACON® YF-10 | Polyplastics Co., Ltd. | Acetal (POM) Copolymer | DURACON® |
