KYOCERA KE-1100A-S3

Category: Epoxy , Epoxy; Epoxide
Manufacturer: KYOCERA Chemical Corporation
Trademark: KYOCERA
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: xgLagl_KYOCERA-KE-1100A-S3.pdf
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Molding Compounds for Area Array Packages (BGA, CSP etc.)

Special Epoxy Molding Compounds Optimizing Warpage and Applicable to Fine Pitch Wire for BGA Package

Strong Points
  • Less Warpage in All Types of Area Array Packages due to High Tg Characteristic.
  • Applicable to Fine Pitch Wire Bonding with Good Wire Sweep Performance.
  • Achieve High Yield after Molding due to Excellent Moldability that allows its application to MAP.

Application
  • Standard P-BGA, HS-BGA and LGA Package.
  • Multi Chip Module (Stacked or Side by Side Layout)
  • IC Card, Memory Card etc.

Low Alpha Ray Type: KE-2100A-S3
General Information
Features
  • Good Moldability
Uses
  • Electrical/Electronic Applications
PhysicalNominal ValueUnit
Specific Gravity 1.90g/cm³
Spiral Flow 190cm
Solution Viscosity 6000mPa·s
MechanicalNominal ValueUnit
Flexural Modulus 15000MPa
Flexural Strength 130MPa
ThermalNominal ValueUnit
Glass Transition Temperature 200°C
CLTE - Flow
    -- 11.4E-5cm/cm/°C
    -- 24.9E-5cm/cm/°C
Note Message
1 .Alpha 1
2 .Alpha 2
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