| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | Epoxies, Etc. |
| Trademark: | Epoxies, Ect. |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | xPwNOw_Epoxies-Ect-50-3185-NC-Catalyst-30-.pdf |
| PRICE: | Order Products email sales@su-jiao.com |
| Message |
|---|
|
50-3185 NC is a filled epoxy encapsulant possessing excellent physical, electrical, and thermal properties. 50-3185 NC is an excellent choice where low thermal expansion, outstanding electrical insulation and/or high thermal conductivity is required. Three catalysts are available to choose from. When cured with Catalyst 190 or Catalyst 30 this system meets NASA's outgassing requirements. Features:
Applications:
|
| General Information | |
|---|---|
| Features |
|
| Uses |
|
| Processing Method |
|
| Physical | Nominal Value | Unit | |
|---|---|---|---|
| Molding Shrinkage - Flow | 0.50 | % |
| Mechanical | Nominal Value | Unit | |
|---|---|---|---|
| Flexural Strength | 124 | MPa |
| Thermal | Nominal Value | Unit | |
|---|---|---|---|
| Glass Transition Temperature | 111 | °C | |
| CLTE - Flow | 2.7E-5 | cm/cm/°C | |
| Thermal Conductivity | 1.3 | W/m/K |
| Thermoset | Nominal Value | Unit | |
|---|---|---|---|
| Thermoset Mix Viscosity (25°C) | 21500 | cP |
| Additional Information | Nominal Value | Unit | |
|---|---|---|---|
| Outgassing | .31% TML | ||
| Thermal Shock Resistance | > 10 | Cycles |
| Uncured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Mix Ratio by Weight (PBW) | |||
| Part A | 100 | ||
| Part B | 7.0 | ||
| Density 1(25°C) | 2.31 | g/cm³ | |
| Viscosity 2(25°C) | 48 | Pa·s | |
| Curing Time | |||
| 100°C | 2.0 to 3.0 | hr | |
| 85°C | 3.0 to 4.0 | hr |
| Cured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Water Absorption 3 | 0.030 | % | |
| Shore Hardness (Shore D) | 96 | ||
| Compression Strength | 187 | MPa | |
| Electric Strength | 15 | kV/mm | |
| Relative Permittivity (1 MHz) | 5.41 | ||
| Volume Resistivity | 4.9E+16 | ohms·cm | |
| Dissipation Factor (1 MHz) | 0.047 |
| Note Message | |
|---|---|
| 1 . | Mixed |
| 2 . | Part A |
| 3 . | After 24 hours |
| Resin Grade | Manufacturer | Category | Trademark |
|---|---|---|---|
| Multi-Flex® TPE A7321 | Multibase, A Dow Corning Company | TPE | Multi-Flex® TPE |
| Cevian®-V MX3 | PlastxWorld Inc. | ABS | Cevian®-V |
| Hetron™ D 1222 | Ashland Performance Materials | Vinyl Ester | Hetron™ |
| KOPLA PA66 KDG1033RD | KOPLA Co., Ltd. | Nylon 66 | KOPLA PA66 |
| LEXAN™ LUX7430C resin | SABIC Innovative Plastics | PC | LEXAN™ |