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Hysol® MG33F-0588
| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | Loctite® |
| Trademark: | Hysol® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | xIVSMI_Hysol-MG33F-0588.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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| Message |
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Hysol® MG33F-0588 is a specially formulated product designed for use in high volume molding of tantalum capacitors. MG33F-0588 is designed to give optimum overall performance and features: -low moisture absorption -excellent moldability -fast cycle times - especially for automold equipment -lasermark capability |
| General Information | |
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| Features |
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| Uses |
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| Appearance |
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| Physical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Specific Gravity | 1.87 | g/cm³ | ASTM D792 |
| Mechanical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Tensile Modulus | 7580 | MPa | ASTM D638 |
| Tensile Strength | 100 | MPa | ASTM D638 |
| Flexural Modulus | 19300 | MPa | ASTM D790 |
| Flexural Strength | 141 | MPa | ASTM D790 |
| Thermal | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Glass Transition Temperature | 170 | °C | DSC |
| CLTE - Flow | ASTM D696 | ||
| 80 to 100°C | 2.0E-5 | cm/cm/°C | ASTM D696 |
| 200 to 240°C | 7.0E-5 | cm/cm/°C | ASTM D696 |
| Electrical | Nominal Value | Test Method | |
|---|---|---|---|
| Dielectric Constant | ASTM D150 | ||
| 25°C, 100 Hz | 4.30 | ASTM D150 | |
| 25°C, 100 kHz | 4.10 | ASTM D150 | |
| Dissipation Factor | ASTM D150 | ||
| 25°C, 100 Hz | 4.0E-3 | ASTM D150 | |
| 25°C, 100 kHz | 0.018 | ASTM D150 |
| Thermoset | Nominal Value | Unit | |
|---|---|---|---|
| Shelf Life (10°C) | 30 | wk | |
| Post Cure Time (150°C) | 2.0 | hr |
| Additional Information |
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| Spiral Flow, STP 10P, 177°C: 27 inHot Plate Gel Time, STP 10S, 177°C: 14 secVolume Resistivity, STP 30H, 100V: 1.25e16 ohm/cmSurface Resistivity, STP 30H, 100V: 1.65e16 ohm/cmWater Extract Data, 20 hr water boil:-Chloride Content: 2 ppm-Sodium Content: 1.5 ppm-Conductivity: 21 µohms-pH: 6.5 |
| Injection | Nominal Value | Unit | |
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| Processing (Melt) Temp | 145 - 177 | °C | |
| Injection Pressure | 3.45 - 10.3 | MPa |
| Injection instructions |
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| Curing Time, 1/8 inch secion, 170°C: 30 to 45 secCuring Time, 1/8 inch secion, 150°C: 1.0 to 1.5 min |
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|---|---|---|---|
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