Plaskon NXG-1 Datasheet,Epoxy,Cookson Electronics - Semiconductor Products-SHANGHAI SUSHENG

Message
This material is an epoxy molding compound for high temperature, lead-free reflow. It is designed to withstand more demanding requirements in moisture performance, occasioned by the higher IR reflow temperatures required for processing lead-free packages. It is a highly filled, hybrid resin developed to pass JEDEC Level 2A at 260°C IR reflow temperature. It is a "green" compound with no halogens and a lower Tg than multifunctional materials.

General Information
Features	Semi-conductive Low (to no) lead content Low hygroscopicity Fast curing Good formability Heat resistance, high
Forms	Liquid
Processing Method	Resin transfer molding

Physical	Nominal Value	Unit	Test Method
Specific Gravity	2.00	g/cm³	ASTM D792

Mechanical	Nominal Value	Unit	Test Method
Flexural Modulus			ASTM D790
22°C	2.55	MPa	ASTM D790
260°C	0.0686	MPa	ASTM D790
Flexural Strength			ASTM D790
22°C	0.0125	MPa	ASTM D790
260°C	8.14E-4	MPa	ASTM D790

Thermal	Nominal Value	Unit	Test Method
Glass Transition Temperature	140	°C	ASTM E1356
CLTE - Flow	8.9E-6	cm/cm/°C	ASTM D696
Thermal Conductivity	0.70	W/m/K	ASTM C177

Flammability	Nominal Value		Test Method
Flame Rating (3.18 mm)	V-0		UL 94

Additional Information
Recommended Storage Temperature: <5°CLife @ 5°C, defined as not more than 40% loss of spiral flow based on original values.: 6 monthsLife @ 22°C, defined as not more than 40% loss of spiral flow based on original values.: 2 daysLife @ 35°C, defined as not more than 40% loss of spiral flow based on original values.: 0.5 daysSpiral Flow, 175°C, 1000 psi: 140 cmShimadzu Viscosity, 175°C, 1000 psi: 40 poiseRam Follower Gel Time, 175°C, 1000 psi: 18 secAsh Content: 88.6 %Hydrolyzable Halides: <1 ppmMoisture Absorption, 85°C/85%RH, 168 hrs: 0.265%Cull Hot Hardness, Shore D: 75All test specimens are transfer molded and post cured for 4 hours at 175°C Linear Thermal Expansion, Alpha 1: 8.9 cm^-6/cm/°C Linear Thermal Expansion, Alpha 2: 36 cm^-6/cm/°C

Additional Information

Recommended Storage Temperature: <5°CLife @ 5°C, defined as not more than 40% loss of spiral flow based on original values.: 6 monthsLife @ 22°C, defined as not more than 40% loss of spiral flow based on original values.: 2 daysLife @ 35°C, defined as not more than 40% loss of spiral flow based on original values.: 0.5 daysSpiral Flow, 175°C, 1000 psi: 140 cmShimadzu Viscosity, 175°C, 1000 psi: 40 poiseRam Follower Gel Time, 175°C, 1000 psi: 18 secAsh Content: 88.6 %Hydrolyzable Halides: <1 ppmMoisture Absorption, 85°C/85%RH, 168 hrs: 0.265%Cull Hot Hardness, Shore D: 75All test specimens are transfer molded and post cured for 4 hours at 175°C Linear Thermal Expansion, Alpha 1: 8.9 cm^-6/cm/°C Linear Thermal Expansion, Alpha 2: 36 cm^-6/cm/°C

Injection instructions
Resin Transfer Molding: Molding Temperature: 165 to 185°C Molding Pressure: 1000 psi In Mold Cure Time: 50 to 100 sec Post Mold Cure Time, 175°C: 0 to 2 hr

Resin Grade	Manufacturer	Category	Trademark
SABIC® PPcompound 6614	Saudi Basic Industries Corporation (SABIC)	PP, Unspecified	SABIC® PPcompound
Sarlink® TPV 3180	Teknor Apex Company	TPV	Sarlink® TPV
NORYL GTX™ GTX934 resin	SABIC Innovative Plastics Asia Pacific	PPE+PS+Nylon	NORYL GTX™
Elastollan® B 60 D	BASF Polyurethanes GmbH	TPU-Polyester	Elastollan®
Hyundai EP Adhesives VE750S/1002	HYUNDAI EP Co., Ltd.	EVA	Hyundai EP Adhesives

Category:	Epoxy , Epoxy; Epoxide
Manufacturer:	Cookson Electronics - Semiconductor Products
Trademark:	Plaskon
Fillers:	-
Ports:	Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms	FOB, CIF, DAP, DAT, DDP
PDF:	wi5gwy_Plaskon-NXG-1.pdf
PRICE:	Order Products email sales@su-jiao.com