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DISTRUMID 6 HI LT
| Category: | Nylon 6 , Polyamide 6 |
| Manufacturer: | Distrupol |
| Trademark: | DISTRUMID |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | wabc3I_DISTRUMID-6-HI-LT.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
Wechat:
| Message |
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| Polyamide 6, high impact resistance also at low temperatures, for injection moulding. |
| General Information | |
|---|---|
| Features |
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| Forms |
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| Processing Method |
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| Physical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Density | 1.06 | g/cm³ | ISO 1183 |
| Molding Shrinkage (23°C) | 2.0 - 2.4 | % | ISO 294-4 |
| Hardness | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Rockwell Hardness (R-Scale) | 105 | ISO 2039-2 |
| Mechanical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Tensile Modulus (23°C) | 1900 | MPa | ISO 527-2/1 |
| Tensile Stress (Yield, 23°C) | 50.0 | MPa | ISO 527-2/500 |
| Tensile Strain (Break, 23°C) | 50 | % | ISO 527-2/5 |
| Impact | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Notched Izod Impact (23°C) | 50 | kJ/m² | ISO 180/1A |
| Thermal | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Heat Deflection Temperature (1.8 MPa, Unannealed) | 50.0 | °C | ISO 75-2/A |
| Vicat Softening Temperature | 200 | °C | ISO 306/B50 |
| Melting Temperature (DSC) | 220 | °C | ISO 3146 |
| Electrical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Surface Resistivity | 1.0E+13 | ohms | IEC 60093 |
| Volume Resistivity | 1.0E+15 | ohms·cm | IEC 60093 |
| Flammability | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Flame Rating (0.800 mm) | HB | UL 94 |
| Additional Information |
|---|
| The value listed as Molding Shrinkage ISO 294-4, was tested in accordance with ISO 2577.Melting Point, DSC: 220 ± 2 °CTensile Strain at Break, ISO 527, 23°C, 50 mm/min: >50% |
| Injection | Nominal Value | Unit | |
|---|---|---|---|
| Drying Temperature | 75.0 - 95.0 | °C | |
| Drying Time | 4.0 - 6.0 | hr | |
| Suggested Max Moisture | 0.20 | % | |
| Processing (Melt) Temp | 230 - 260 | °C | |
| Mold Temperature | 60.0 - 80.0 | °C | |
| Back Pressure | 0.300 - 0.500 | MPa |
| Resin Grade | Manufacturer | Category | Trademark |
|---|---|---|---|
| Tectron H2396 | TECTRON Systems Pte Ltd | TPV | Tectron |
| TAIRIPRO K7005AX | Formosa Plastics Corporation | PP Impact Copolymer | TAIRIPRO |
| Hostacom TKS709D | LyondellBasell Industries | TPO (POE) | Hostacom |
| LUVOCOM® 55-9000/WT | Lehmann & Voss & Co. | PC+ABS | LUVOCOM® |
| Purell RP170G | LyondellBasell Industries | PP, Unspecified | Purell |
