Plaskon 7090 Datasheet,Epoxy,Cookson Electronics - Semiconductor Products-SHANGHAI SUSHENG

Message
This material is a high thermal conductivity epoxy molding compound for the encapsulation of a variety of semiconductor devices ranging from small lead count DIPs to medium lead count PLCCs and power devices. It was especially developed for balanced end use properties.

General Information
Features	Semi-conductive Laser marking Good formability Excellent appearance
Forms	Liquid
Processing Method	Resin transfer molding

Physical	Nominal Value	Unit	Test Method
Specific Gravity	2.09	g/cm³	ASTM D792
Molding Shrinkage - Flow	0.70	%	ASTM D955

Mechanical	Nominal Value	Unit	Test Method
Flexural Modulus	1.38	MPa	ASTM D790
Flexural Strength	0.0124	MPa	ASTM D790

Thermal	Nominal Value	Unit	Test Method
Glass Transition Temperature	160	°C	ASTM E1356
CLTE - Flow	3.0E-5	cm/cm/°C	ASTM D696
Thermal Conductivity	32	W/m/K	ASTM C177

Electrical	Nominal Value	Unit	Test Method
Volume Resistivity	7.8E+15	ohms·cm	ASTM D257
Dielectric Strength	12	kV/mm	ASTM D149
Dielectric Constant (1 kHz)	5.00		ASTM D150
Dissipation Factor (1 kHz)	0.010		ASTM D150
Arc Resistance	180	sec	ASTM D495

Flammability	Nominal Value	Unit	Test Method
Flame Rating (3.18 mm)	V-0		UL 94
Oxygen Index	28	%	ASTM D2863

Additional Information
Recommended Storage Temperature: 5°CLife @ 5°C, defined as not more than 40% loss of spiral flow based on original values.: 24 monthsLife @ 21°C, defined as not more than 40% loss of spiral flow based on original values.: 5 daysLife @ 35°C, defined as not more than 40% loss of spiral flow based on original values.: 2 daysSpiral Flow, 177°C, 1000 psi: 82 to 93 cmAutomatic Orifice Viscosity, 175°C, Shear Rate is 157000 sec-1, 1 mm die length, 1/2 mm diameter: 130 Pascal secRam Follower Gel Time, 177°C: 10 to 18 secAsh Content: 72.7 %Hydrolyzable Halides: 100 ppmCull Hot Hardness, Shore D, 90 sec, 175°C: 75Arc Resistance, 110v AC180 secAll test specimens are transfer molded and post cured for 4 hours at 175°C Linear Thermal Expansion, Alpha 1: 30 cm^-6/cm/°C Linear Thermal Expansion, Alpha 2: 80 cm^-6/cm/°C

Additional Information

Recommended Storage Temperature: 5°CLife @ 5°C, defined as not more than 40% loss of spiral flow based on original values.: 24 monthsLife @ 21°C, defined as not more than 40% loss of spiral flow based on original values.: 5 daysLife @ 35°C, defined as not more than 40% loss of spiral flow based on original values.: 2 daysSpiral Flow, 177°C, 1000 psi: 82 to 93 cmAutomatic Orifice Viscosity, 175°C, Shear Rate is 157000 sec-1, 1 mm die length, 1/2 mm diameter: 130 Pascal secRam Follower Gel Time, 177°C: 10 to 18 secAsh Content: 72.7 %Hydrolyzable Halides: 100 ppmCull Hot Hardness, Shore D, 90 sec, 175°C: 75Arc Resistance, 110v AC180 secAll test specimens are transfer molded and post cured for 4 hours at 175°C Linear Thermal Expansion, Alpha 1: 30 cm^-6/cm/°C Linear Thermal Expansion, Alpha 2: 80 cm^-6/cm/°C

Injection instructions
Resin Transfer Molding: Preheat Temperature: 102 to 106°C Molding Temperature: 175 to 179°C Molding Pressure: 750 to 1000 psi Cure Time, 177°C: 1 to 2min Post Mold Cure Time, 175°C: 2 hr

Category:	Epoxy , Epoxy; Epoxide
Manufacturer:	Cookson Electronics - Semiconductor Products
Trademark:	Plaskon
Fillers:	-
Ports:	Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms	FOB, CIF, DAP, DAT, DDP
PDF:	wONYZB_Plaskon-7090.pdf
PRICE:	Order Products email sales@su-jiao.com

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