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EPO-TEK® H67MP-T
| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | Epoxy Technology Inc. |
| Trademark: | EPO-TEK® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | wGu8x4_EPO-TEK-H67MP-T.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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| A single component, thermally conductive, electrically insulating epoxy designed to meet the requirements of MIL-STD 883, Test Method 5011 for hybrid microelectronic packaging and assemblies. It may be used for bonding SMDs, die-attach, substrate-attach or general heat sinking. Meets MIL-STD-883, Method 5011. A thixotropic version of EPO-TEK® H67MP. |
| General Information | |
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| Features |
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| Uses |
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| Agency Ratings |
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| RoHS Compliance |
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| Physical | Nominal Value | Unit | |
|---|---|---|---|
| Ion Type | |||
| Cl- | < 200 | ppm | |
| K+ | < 50 | ppm | |
| Na+ | < 50 | ppm | |
| NH4+ | 71 | ppm | |
| Particle Size | < 20.0 | µm |
| Additional Information | Nominal Value | Unit | |
|---|---|---|---|
| Degradation Temperature | 370 | °C | |
| Die Shear Strength - >20 kg (23°C) | 53.8 | MPa | |
| Operating Temperature | |||
| Continuous | -55 to 200 | °C | |
| Intermittent | -55 to 300 | °C | |
| Storage Modulus (23°C) | 4.96 | GPa | |
| Weight Loss on Heating | |||
| 200°C | 0.23 | % | |
| 250°C | 0.33 | % | |
| 300°C | 0.59 | % |
| Thermal | Nominal Value | Unit | |
|---|---|---|---|
| Glass Transition Temperature 1 | 101 | °C | |
| CLTE - Flow | |||
| -- 2 | 3.5E-5 | cm/cm/°C | |
| -- 3 | 9.3E-5 | cm/cm/°C | |
| Thermal Conductivity | 0.89 | W/m/K |
| Thermoset | Nominal Value | Unit | |
|---|---|---|---|
| Shelf Life (-40°C) | 52 | wk |
| Uncured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Color | White | ||
| Density | 1.97 | g/cm³ | |
| Viscosity 4(23°C) | 610 | Pa·s | |
| Curing Time (150°C) | 1.0 | hr | |
| Pot Life | 40000 | min |
| Cured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Shore Hardness (Shore D) | 94 | ||
| Lap Shear Strength (23°C) | > 13.8 | MPa | |
| Relative Permittivity (1 kHz) | 5.36 | ||
| Volume Resistivity (23°C) | > 8.0E+13 | ohms·cm | |
| Dissipation Factor (1 kHz) | 5.0E-3 |
| Note Message | |
|---|---|
| 1 . | Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min |
| 2 . | Below Tg |
| 3 . | Above Tg |
| 4 . | 0.5 rpm |
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