Epoxies, Ect. 20-2121

Category: PUR, Unspecified , Polyurethane
Manufacturer: Epoxies, Etc.
Trademark: Epoxies, Ect.
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: vp9Bem_Epoxies-Ect-20-2121.pdf
PRICE: ​Order Products​ email   sales@su-jiao.com
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Message
20-2121 is formulated for electronic potting, encapsulating and casting applications. The 20-2121 is a two-component, low viscosity, room temperature curing system. This is an easy to use product that does not contain TDI, MbOCA or Mercury. 20-2121 will cushion and protect sensitive electronic components. It will impart very little stress on components during cure or thermal cycling.

The 20-2121 Polyurethane meets the Food and Drug Administration (FDA) regulations permitting use in food contact applications. The raw materials used in this product comply with the FDA regulations of Title 21 Code of Federal Regulations under Sections 175.105 and 175.300.

The base Natural Oil Polyol (NOP) used in 20-2121 is obtained directly from a plant source without chemical modifications. Due to the raw materials selected, this product is low in toxicity and considered a GREEN potting compound. Using renewable resources such as NOPs will reduce the demand on non-renewable fossil fuels and reduce the overall production of carbon dioxide.

Features:
  • Low Toxicity
  • Green
  • Low Viscosity
  • Low Durometer
  • Moisture Resistant
  • Low Shrinkage & Exotherm
  • FDA compliant

Benefits:
  • Reduce employee exposure to dangerous chemicals
  • Reduce demand on non-renewable fossil fuels
  • Quick self leveling around components
  • Low stress on components & vibration resistant
  • Can be used in wet environments
  • Will not damage components during cure
  • May be used in food contact applications
General Information
Features
  • Food Contact Acceptable
  • Low Exotherm
  • Low Shrinkage
  • Low to No Water Absorption
  • Low Toxicity
  • Low Viscosity
  • Renewable Resource Content
Uses
  • Electrical Parts
  • Electrical/Electronic Applications
  • Food Service Applications
  • Non-specific Food Applications
Agency Ratings
  • FDA 21 CFR 175.105
  • FDA 21 CFR 175.300
Appearance
  • Clear Amber
Processing Method
  • Casting
  • Encapsulating
  • Potting
PhysicalNominal ValueUnit
Molding Shrinkage - Flow 0.014%
ThermalNominal ValueUnit
CLTE - Flow 2.1E-4cm/cm/°C
Thermal Conductivity 0.30W/m/K
ElectricalNominal ValueUnit
Surface Resistivity > 1.0E+15ohms
ThermosetNominal ValueUnit
Thermoset Mix Viscosity (25°C)3200cP
Additional InformationNominal ValueUnit
Operating Temperature -30.0 to 125°C
Uncured PropertiesNominal ValueUnit
Color Amber Clear/Transparent
Mix Ratio by Weight (PBW)
    Part A 100
    Part B 120
Density
    25°C 10.958g/cm³
    25°C 21.14g/cm³
Viscosity
    25°C 30.80Pa·s
    25°C 420Pa·s
Curing Time
    85°C 0.66hr
    65°C 1.5hr
    45°C 2.5hr
    25°C 24hr
Gel Time
    60°C 20min
    25°C 90min
Cured PropertiesNominal ValueUnit
Shore Hardness (Shore A)65
Tensile Strength 13.8MPa
Tensile Elongation at Break 160%
Tear Strength 20.8kN/m
Electric Strength 26kV/mm
Relative Permittivity (1 kHz)3.40
Volume Resistivity 7.2E+14ohms·cm
Dissipation Factor (1 kHz)0.017
Note Message
1 .Part A
2 .Part B
3 .Part A
4 .Part B
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