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EPO-TEK® H20E-175
| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | Epoxy Technology Inc. |
| Trademark: | EPO-TEK® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | v4KIWy_EPO-TEK-H20E-175.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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| Message |
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| EPO-TEK® H20E-175 is a two component epoxy designed for semiconductor die-attach. It is a higher Tg version of EPO-TEK® H20E. It was designed to be used in semiconductor / JEDEC packaging, microelectronic packaging of hybrids, as well as high temperature devices and assembly. |
| General Information | |
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| Features |
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| Uses |
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| Agency Ratings |
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| RoHS Compliance |
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| Forms |
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| Physical | Nominal Value | Unit | |
|---|---|---|---|
| Particle Size | < 45.0 | µm |
| Additional Information | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Degradation Temperature | 450 | °C | TGA |
| Die Shear Strength - >10 kg (23°C) | 23.4 | MPa | |
| Operating Temperature | |||
| Continuous | -55 to 250 | °C | |
| Intermittent | -55 to 350 | °C | |
| Storage Modulus (23°C) | 4.33 | GPa | |
| Thixotropic Index | 3.10 | ||
| Weight Loss on Heating | |||
| 200°C | 0.050 | % | |
| 250°C | 0.11 | % | |
| 300°C | 0.25 | % |
| Thermal | Nominal Value | Unit | |
|---|---|---|---|
| Glass Transition Temperature 1 | > 85.0 | °C | |
| CLTE - Flow | |||
| -- 2 | 2.0E-5 | cm/cm/°C | |
| -- 3 | 8.8E-5 | cm/cm/°C | |
| Thermal Conductivity | 2.0 | W/m/K |
| Thermoset | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Thermoset Components | |||
| Part A | Mix Ratio by Weight: 1.0 | ||
| Part B | Mix Ratio by Weight: 1.0 | ||
| Shelf Life (23°C) | 52 | wk |
| Uncured Properties | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Color | |||
| -- 4 | Silver | ||
| -- 5 | Silver | ||
| Density | |||
| Part A | 2.43 | g/cm³ | |
| Part B | 3.06 | g/cm³ | |
| Viscosity 6(23°C) | 2.8 to 3.8 | Pa·s | |
| Curing Time (180°C) | 1.0 | hr | |
| Pot Life | 5000 | min |
| Cured Properties | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Shore Hardness (Shore D) | 70 | ||
| Lap Shear Strength (23°C) | 8.91 | MPa | |
| Volume Resistivity (23°C) | < 4.0E-4 | ohms·cm |
| Note Message | |
|---|---|
| 1 . | Dynamic Cure 20-250°C/ISO 25 Min; Ramp -10-250°C @ 20°C/Min |
| 2 . | Below Tg |
| 3 . | Above Tg |
| 4 . | Part B |
| 5 . | Part A |
| 6 . | 100 rpm |
| Resin Grade | Manufacturer | Category | Trademark |
|---|---|---|---|
| Matrixx CPP1B20 | The Matrixx Group, Inc. | PP, Unspecified | Matrixx |
| Forprene® 6NM901A50 | SO.F.TER. SPA | TPV | Forprene® |
| Lucel® FW700N | LG Chem Ltd. | Acetal (POM) Copolymer | Lucel® |
| SECCO S2040 | Shanghai SECCO Petrochemical Co., Ltd | PP Homopolymer | SECCO |
| Monprene® SP-14986 XRD1 PRELIMINARY DATA) | Teknor Apex Company | TPE | Monprene® |
