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EMERGE™ PC/ABS 7570EP
| Category: | PC+ABS , Advanced Resin |
| Manufacturer: | Trinseo |
| Trademark: | EMERGE™ |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | uvBVTG_EMERGE-PC-ABS-7570EP.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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EMERGE™ PC/ABS 7570EP Advanced Resin is a high flow, ignition resistant PC/ABS blend that contains no chlorinated or brominated additives. This resin is specifically designed to offer enhanced processing in "heat and cool" moulding applications, delivering optimum filling and packing performance. EMERGE™ PC/ABS 7570EP is suitable for moulding a wide range of parts in the Information Technology Equipment & Consumer Electronics & Electrical devices. Applications:
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| General Information | |
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| Features |
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| Uses |
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| Forms |
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| Processing Method |
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| Physical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Density | 1.18 | g/cm³ | ISO 1183/B |
| Apparent Density | 0.67 | g/cm³ | ISO 60 |
| Melt Mass-Flow Rate (MFR) (220°C/10.0 kg) | 48 | g/10 min | ISO 1133 |
| Molding Shrinkage | ISO 294-4 | ||
| Across Flow | 0.39 to 0.43 | % | |
| Flow | 0.41 to 0.46 | % |
| Hardness | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Rockwell Hardness (R-Scale) | 120 | ISO 2039-2 |
| Mechanical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Tensile Modulus | 2740 | MPa | ISO 527-2/1 |
| Tensile Stress | ISO 527-2/50 | ||
| Yield | 63.0 | MPa | |
| Break | 49.0 | MPa | |
| Tensile Strain | ISO 527-2/50 | ||
| Yield | 3.9 | % | |
| Break | 15 | % | |
| Flexural Modulus 1 | 2700 | MPa | ISO 178 |
| Flexural Stress 2 | 92.0 | MPa | ISO 178 |
| Impact | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Notched Izod Impact Strength (23°C) | 9.0 | kJ/m² | ISO 180/A |
| Thermal | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Heat Deflection Temperature (1.8 MPa, Unannealed) | 79.0 | °C | ISO 75-2/A |
| Vicat Softening Temperature | 104 | °C | ISO 306/A120 |
| Electrical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Surface Resistivity | > 1.0E+15 | ohms | IEC 60093 |
| Volume Resistivity | > 1.0E+15 | ohms·cm | IEC 60093 |
| Electric Strength | 35 | kV/mm | IEC 60243-1 |
| Dielectric Constant | IEC 60250 | ||
| 100 Hz | 3.20 | ||
| 1 MHz | 3.10 | ||
| Dissipation Factor | IEC 60250 | ||
| 100 Hz | 4.0E-3 | ||
| 1 MHz | 7.0E-3 |
| Flammability | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Flame Rating 3(1.60 mm) | V-0 | UL 94 | |
| Glow Wire Flammability Index 4 | IEC 60695-2-12 | ||
| 1.00 mm | 960 | °C | |
| 2.00 mm | 960 | °C | |
| 3.00 mm | 960 | °C | |
| Glow Wire Ignition Temperature 5 | IEC 60695-2-13 | ||
| 1.00 mm | 800 | °C | |
| 2.00 mm | 800 | °C | |
| 3.00 mm | 800 | °C | |
| Needle Flame Test 6(1.50 mm) | PASS | IEC 60695-2-2 |
| Injection | Nominal Value | Unit | |
|---|---|---|---|
| Drying Temperature | 80.0 to 85.0 | °C | |
| Drying Time | 3.0 to 4.0 | hr | |
| Processing (Melt) Temp | 230 to 280 | °C | |
| Mold Temperature | 40.0 to 80.0 | °C |
| Note Message | |
|---|---|
| 1 . | 2.0 mm/min |
| 2 . | 2.0 mm/min |
| 3 . | This rating not intended to reflect hazards presented by this or any other material under actual fire conditions. |
| 4 . | This rating not intended to reflect hazards presented by this or any other material under actual fire conditions. |
| 5 . | This rating not intended to reflect hazards presented by this or any other material under actual fire conditions. |
| 6 . | This rating not intended to reflect hazards presented by this or any other material under actual fire conditions. |
| Resin Grade | Manufacturer | Category | Trademark |
|---|---|---|---|
| RTP VLF 80205 EM HS | RTP Company | Nylon 66 | RTP |
| Multiuse Leostomer® LE-3160N | Riken Technos Corp. | TPU, Unspecified | Multiuse Leostomer® |
| Abstron IM11G | Bhansali Engineering Polymers Limited | ABS | Abstron |
| BMC 695 | Bulk Molding Compounds, Inc. | Vinyl Ester | BMC |
| AvaSpire® AV-651 GF30 | Solvay Specialty Polymers | PAEK | AvaSpire® |
