BMC 940 Datasheet,Vinyl Ester,Bulk Molding Compounds, Inc.-SHANGHAI SUSHENG

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BMC 940 is a Vinyl Ester product,. It can be processed by compression molding and is available in North America. BMC 940 applications include electrical/electronic applications, electrical appliances and the automotive industry. Features include: flame retardant/rated flame Corrosion resistance

General Information
Features	Good electrical performance Good corrosion resistance
Uses	Electrical/Electronic Applications Home appliance components Application in Automobile Field
Forms	BMC-Block Molding Compound
Processing Method	Compression molding

Physical	Nominal Value	Unit	Test Method
Specific Gravity	1.82	g/cm³	ASTM D792
Molding Shrinkage - Flow	0.10	%	ASTM D955
Water Absorption (23°C, 24 hr)	0.060	%	ASTM D570

Mechanical	Nominal Value	Unit	Test Method
Tensile Modulus	11000	MPa	ASTM D638
Tensile Strength (Yield)	30.3	MPa	ASTM D638
Tensile Elongation (Yield)	4.0E-3	%	ASTM D638
Flexural Modulus	10300	MPa	ASTM D790
Flexural Strength	40.0	MPa	ASTM D790

Impact	Nominal Value	Unit	Test Method
Unnotched Izod Impact	16	J/m	ASTM D256
Instrumented Dart Impact (23°C, Total Energy)	3.57	J	ASTM D3763

Thermal	Nominal Value	Unit	Test Method
Glass Transition Temperature	200	°C	ASTM E1356

Flammability	Nominal Value		Test Method
Flame Rating (3.56 mm)	V-0		UL 94

Additional Information
Conductivity, Vendor, Through Plane (Z-direction): 50 S/cmConductivity, Vendor, In Plane (X,Y direction): 100 S/cmInstrumented Impact, ASTM D3763, 23°C, Max Load=169 lbs, Total Energy: 2.63 ft-lbInstrumented Impact, ASTM D3763, 23°C, Max Load=169 lbs, Energy to Max Load: 0.55 ft-lbCompressive Creep, ASTM D2990, 200 psi, 200 hr @ 80°C: 0.025%Compressive Creep, ASTM D2990, 200 psi, 1000 hr @ 80°C: 0.040%DMA-Modulus, ASTM D4065, 25°C: 2.0x10^6DMA-Modulus, ASTM D4065, 100°C: 1.6x10^6DMA-Modulus, ASTM D4065, 150°C: 1.23x10^6DMA-Modulus, ASTM D4065, 175°C: 0.94x10^6DMA-Modulus, ASTM D4065, 200°C: 0.50x10^6Thermal Expansion, E831: 30 micro m/m°CThermal Conductivity, E1461-92, In-Plane, 25°C: 46.2 W/m-KThermal Conductivity, E1461-92, In-Plane, 85°C: 43.7 W/m-KThermal Conductivity, E1461-92, Through-Plane, 25°C: 19.2 W/m-KThermal Conductivity, E1461-92, Through-Plane, 85°C: 18.5 W/m-KDiffusivity, E1461-92, In-Plane, 25°C: 0.302 cm^2/sDiffusivity, E1461-92, In-Plane, 85°C: 0.231 cm^2/sDiffusivity, E1461-92, Through-Plane, 25°C: 0.125 cm^2/sDiffusivity, E1461-92, Through-Plane, 85°C: 0.098 cm^2/s

Additional Information

Conductivity, Vendor, Through Plane (Z-direction): 50 S/cmConductivity, Vendor, In Plane (X,Y direction): 100 S/cmInstrumented Impact, ASTM D3763, 23°C, Max Load=169 lbs, Total Energy: 2.63 ft-lbInstrumented Impact, ASTM D3763, 23°C, Max Load=169 lbs, Energy to Max Load: 0.55 ft-lbCompressive Creep, ASTM D2990, 200 psi, 200 hr @ 80°C: 0.025%Compressive Creep, ASTM D2990, 200 psi, 1000 hr @ 80°C: 0.040%DMA-Modulus, ASTM D4065, 25°C: 2.0x10^6DMA-Modulus, ASTM D4065, 100°C: 1.6x10^6DMA-Modulus, ASTM D4065, 150°C: 1.23x10^6DMA-Modulus, ASTM D4065, 175°C: 0.94x10^6DMA-Modulus, ASTM D4065, 200°C: 0.50x10^6Thermal Expansion, E831: 30 micro m/m°CThermal Conductivity, E1461-92, In-Plane, 25°C: 46.2 W/m-KThermal Conductivity, E1461-92, In-Plane, 85°C: 43.7 W/m-KThermal Conductivity, E1461-92, Through-Plane, 25°C: 19.2 W/m-KThermal Conductivity, E1461-92, Through-Plane, 85°C: 18.5 W/m-KDiffusivity, E1461-92, In-Plane, 25°C: 0.302 cm^2/sDiffusivity, E1461-92, In-Plane, 85°C: 0.231 cm^2/sDiffusivity, E1461-92, Through-Plane, 25°C: 0.125 cm^2/sDiffusivity, E1461-92, Through-Plane, 85°C: 0.098 cm^2/s

Injection	Nominal Value	Unit
Mold Temperature	163 - 168	°C

Injection instructions
Cure Time: 30-60 secRecommended tonnage: 3 tons per square inch of projected part area

Category:	Vinyl Ester , Vinyl Ester
Manufacturer:	Bulk Molding Compounds, Inc.
Trademark:	BMC
Fillers:	-
Ports:	Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms	FOB, CIF, DAP, DAT, DDP
PDF:	ukGRsU_BMC-940.pdf
PRICE:	Order Products email sales@su-jiao.com

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