EPO-TEK® EM127

Category: Epoxy , Epoxy; Epoxide
Manufacturer: Epoxy Technology Inc.
Trademark: EPO-TEK®
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: u4EkVz_EPO-TEK-EM127.pdf
PRICE: ​Order Products​ email   sales@su-jiao.com
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Message
EPO-TEK® EM127 is a single component, heat curable, electrically conductive epoxy adhesive for semiconductor IC and LED die attach applications.
General Information
Features
  • Electrically Conductive
  • Heat Cure
  • Low Viscosity
  • Thixotropic
Uses
  • Adhesives
  • Electrical/Electronic Applications
  • LEDs
  • Printed Circuit Boards
Agency Ratings
  • EC 1907/2006 (REACH)
  • EU 2003/11/EC
  • EU 2006/122/EC
RoHS Compliance
  • RoHS Compliant
Forms
  • Paste
PhysicalNominal ValueUnit
Particle Size < 20.0µm
Additional InformationNominal ValueUnitTest Method
Degradation Temperature 380°CTGA
Die Shear Strength - >10 kg (23°C) 23.4MPa
Operating Temperature
    Continuous -55 to 200°C
    Intermittent -55 to 300°C
Storage Modulus (23°C) 4.67GPa
Thixotropic Index 5.50
Weight Loss on Heating
    200°C 0.22%
    300°C 0.65%
ThermalNominal ValueUnit
Glass Transition Temperature 1> 65.0°C
CLTE - Flow
    -- 22.8E-5cm/cm/°C
    -- 31.2E-4cm/cm/°C
Thermal Conductivity 1.2W/m/K
ThermosetNominal ValueUnitTest Method
Shelf Life (-40°C)52wk
Uncured PropertiesNominal ValueUnitTest Method
Color Silver
Density 2.73g/cm³
Viscosity 4(23°C)2.5 to 3.3Pa·s
Curing Time (160°C)0.50hr
Pot Life 40000min
Cured PropertiesNominal ValueUnitTest Method
Shore Hardness (Shore D)85
Volume Resistivity (23°C)< 9.0E-4ohms·cm
Note Message
1 .Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min
2 .Below Tg
3 .Above Tg
4 .100 rpm
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