| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | Epoxy Technology Inc. |
| Trademark: | EPO-TEK® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | u4EkVz_EPO-TEK-EM127.pdf |
| PRICE: | Order Products email sales@su-jiao.com |
| Message |
|---|
| EPO-TEK® EM127 is a single component, heat curable, electrically conductive epoxy adhesive for semiconductor IC and LED die attach applications. |
| General Information | |
|---|---|
| Features |
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| Uses |
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| Agency Ratings |
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| RoHS Compliance |
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| Forms |
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| Physical | Nominal Value | Unit | |
|---|---|---|---|
| Particle Size | < 20.0 | µm |
| Additional Information | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Degradation Temperature | 380 | °C | TGA |
| Die Shear Strength - >10 kg (23°C) | 23.4 | MPa | |
| Operating Temperature | |||
| Continuous | -55 to 200 | °C | |
| Intermittent | -55 to 300 | °C | |
| Storage Modulus (23°C) | 4.67 | GPa | |
| Thixotropic Index | 5.50 | ||
| Weight Loss on Heating | |||
| 200°C | 0.22 | % | |
| 300°C | 0.65 | % |
| Thermal | Nominal Value | Unit | |
|---|---|---|---|
| Glass Transition Temperature 1 | > 65.0 | °C | |
| CLTE - Flow | |||
| -- 2 | 2.8E-5 | cm/cm/°C | |
| -- 3 | 1.2E-4 | cm/cm/°C | |
| Thermal Conductivity | 1.2 | W/m/K |
| Thermoset | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Shelf Life (-40°C) | 52 | wk |
| Uncured Properties | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Color | Silver | ||
| Density | 2.73 | g/cm³ | |
| Viscosity 4(23°C) | 2.5 to 3.3 | Pa·s | |
| Curing Time (160°C) | 0.50 | hr | |
| Pot Life | 40000 | min |
| Cured Properties | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Shore Hardness (Shore D) | 85 | ||
| Volume Resistivity (23°C) | < 9.0E-4 | ohms·cm |
| Note Message | |
|---|---|
| 1 . | Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min |
| 2 . | Below Tg |
| 3 . | Above Tg |
| 4 . | 100 rpm |
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