CONAP® CE-2290

Category:	Acrylic, Unspecified , Acrylic
Manufacturer:	Cytec Industries Inc.
Trademark:	CONAP®
Fillers:	-
Ports:	Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms	FOB, CIF, DAP, DAT, DDP
PDF:	txNgxk_CONAP-CE-2290.pdf
PRICE:	Order Products email sales@su-jiao.com

Wechat: WECHAT

Message
CONAP CE-2290 is a single-component acrylic conformal coating that is formulated with non-petroleum-based, bio-derived solvents. The product is on the qualified products list (QPL) for MIL-I-46058C and is approved to the IPC-CC-830B for Type AR coatings. The solvent portion of CONAP CE-2290 is an EPA-approved SNAP composition containing no ozone depleting chemicals. It is non-carcinogenic, contains no HAPs and is non- SARA reportable. CONAP CE-2290 is designed for thin-film applications on components and printed circuitry. It provides fast drying times, reparability, outstanding humidity resistance and hydrolytic stability. CONAP CE-2290 has outstanding electrical properties and retains excellent flexibility to prevent fracturing of fragile components during thermal cycling. Cured films maintain excellent adhesion to phenolic and epoxy glass laminates even in adverse environmental conditions. Component removal is possible by melting through the coating with a soldering iron. Removal of the entire coating is possible with a suitable solvent. CONAP CE-2290 incorporates a tracer dye to aid inspection under ultraviolet light.

Message

CONAP CE-2290 is a single-component acrylic conformal coating that is formulated with non-petroleum-based, bio-derived solvents. The product is on the qualified products list (QPL) for MIL-I-46058C and is approved to the IPC-CC-830B for Type AR coatings. The solvent portion of CONAP CE-2290 is an EPA-approved SNAP composition containing no ozone depleting chemicals. It is non-carcinogenic, contains no HAPs and is non- SARA reportable.

CONAP CE-2290 is designed for thin-film applications on components and printed circuitry. It provides fast drying times, reparability, outstanding humidity resistance and hydrolytic stability. CONAP CE-2290 has outstanding electrical properties and retains excellent flexibility to prevent fracturing of fragile components during thermal cycling.

Cured films maintain excellent adhesion to phenolic and epoxy glass laminates even in adverse environmental conditions. Component removal is possible by melting through the coating with a soldering iron. Removal of the entire coating is possible with a suitable solvent. CONAP CE-2290 incorporates a tracer dye to aid inspection under ultraviolet light.

General Information
Features	Good Adhesion Good Electrical Properties Good Flexibility Humidity Resistant Hydrolytically Stable
Uses	Coating Applications Film Printed Circuit Boards Semiconductor Protective Coatings
Agency Ratings	MIL I-46058C
Appearance	Amber Clear/Transparent
Processing Method	Coating

Physical	Nominal Value	Unit	Test Method
Specific Gravity	0.940	g/cm³
Solids Content	28	%
Viscosity (25°C)	350	mPa·s	Brookfield

Electrical	Nominal Value	Unit
Volume Resistivity (25°C)	2.5E+15	ohms·cm
Dielectric Strength	> 120	kV/mm
Dielectric Constant (25°C, 100 Hz)	2.50 to 3.00
Dissipation Factor (25°C, 14 kHz)	0.014
Insulation Resistance ¹(25°C, 0.0508 mm)	2.8E+12	ohms

Note Message
1 .	After conditioning 24 hours @ 25°C and 50% R.H.

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