Category: | Epoxy , Epoxy; Epoxide |
Manufacturer: | Epoxy Technology Inc. |
Trademark: | EPO-TEK® |
Fillers: | - |
Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
Delivery Terms | FOB, CIF, DAP, DAT, DDP |
PDF: | tqQYGE_EPO-TEK-H70S.pdf ![]() |
PRICE: | Order Products email sales@su-jiao.com |
Message |
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EPO TEK® H70S is a modified version of EPO TEK ® H70E, designed primarily for die stamping. It is a highly reliable, alumina- filled epoxy with a smooth, flowable consistency, designed for chip bonding in micro-electronic and opto-electronic applications. |
General Information | |
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Features |
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Uses |
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Agency Ratings |
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RoHS Compliance |
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Forms |
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Processing Method |
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Physical | Nominal Value | Unit | |
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Ion Type | |||
Cl- | 231 | ppm | |
K+ | 39 | ppm | |
Na+ | 95 | ppm | |
Particle Size | < 20.0 | µm |
Additional Information | Nominal Value | Unit | Test Method |
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Degradation Temperature | 400 | °C | TGA |
Die Shear Strength - >10 kg (23°C) | 23.4 | MPa | |
Operating Temperature | |||
Continuous | -55 to 200 | °C | |
Intermittent | -55 to 300 | °C | |
Storage Modulus (23°C) | 2.41 | GPa | |
Thixotropic Index | 1.37 | ||
Weight Loss on Heating (250°C) | 2.3 | % |
Thermal | Nominal Value | Unit | |
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Glass Transition Temperature 1 | > 50.0 | °C | |
CLTE - Flow | |||
-- 2 | 4.0E-5 | cm/cm/°C | |
-- 3 | 1.9E-4 | cm/cm/°C | |
Thermal Conductivity | 0.44 | W/m/K |
Thermoset | Nominal Value | Unit | Test Method |
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Thermoset Components | |||
Part A | Mix Ratio by Weight: 1.0 | ||
Part B | Mix Ratio by Weight: 1.0 | ||
Shelf Life (23°C) | 52 | wk |
Uncured Properties | Nominal Value | Unit | Test Method |
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Color | |||
-- 4 | Cream | ||
-- 5 | Grey | ||
Density | |||
Part A | 1.25 | g/cm³ | |
Part B | 2.02 | g/cm³ | |
Viscosity 6(23°C) | 1.3 to 1.8 | Pa·s | |
Curing Time (150°C) | 1.0 | hr | |
Pot Life | 4300 | min |
Cured Properties | Nominal Value | Unit | Test Method |
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Shore Hardness (Shore D) | 83 | ||
Lap Shear Strength (23°C) | > 13.8 | MPa | |
Relative Permittivity (1 kHz) | 4.97 | ||
Volume Resistivity | > 7.0E+13 | ohms·cm | |
Dissipation Factor (1 kHz) | 0.016 |
Note Message | |
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1 . | Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min |
2 . | Below Tg |
3 . | Above Tg |
4 . | Part A |
5 . | Part B |
6 . | 100 rpm |
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