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EPO-TEK® B9126-8
| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | Epoxy Technology Inc. |
| Trademark: | EPO-TEK® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | tDCbK8_EPO-TEK-B9126-8.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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| Message |
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| A single component, thermally and electrically conductive, epoxy adhesive designed for semiconductor die attach and circuit assembly applications. Its unique features are a pot-life of several days, low temperature cure and syringe dispensing rheology. It can be used for electrical connections when bonding chips, SMDs, PCBs and substrates. |
| General Information | |
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| Features |
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| Uses |
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| Agency Ratings |
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| RoHS Compliance |
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| Forms |
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| Physical | Nominal Value | Unit | |
|---|---|---|---|
| Ion Type | |||
| Cl- | 80 | ppm | |
| K+ | 8 | ppm | |
| Na+ | 23 | ppm | |
| NH4+ | 41 | ppm | |
| Particle Size | < 30.0 | µm |
| Additional Information | Nominal Value | Unit | |
|---|---|---|---|
| Degradation Temperature | 340 | °C | |
| Die Shear Strength - >5 kg (23°C) | 11.7 | MPa | |
| Operating Temperature | |||
| Continuous | -55 to 175 | °C | |
| Intermittent | -55 to 275 | °C | |
| Storage Modulus (23°C) | 1.57 | GPa | |
| Thixotropic Index | 3.20 | ||
| Weight Loss on Heating (300°C) | 1.1 | % |
| Thermal | Nominal Value | Unit | |
|---|---|---|---|
| Glass Transition Temperature 1 | > 60.0 | °C | |
| Thermal Conductivity | 1.2 | W/m/K |
| Thermoset | Nominal Value | Unit | |
|---|---|---|---|
| Shelf Life 2 | 52 | wk |
| Uncured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Color | Silver | ||
| Density | 2.91 | g/cm³ | |
| Viscosity 3(23°C) | 11 to 19 | Pa·s | |
| Curing Time (150°C) | 1.0 | hr | |
| Pot Life | 7200 | min |
| Cured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Shore Hardness (Shore D) | 71 | ||
| Lap Shear Strength (23°C) | 6.76 | MPa | |
| Volume Resistivity (23°C) | < 2.0E-4 | ohms·cm |
| Note Message | |
|---|---|
| 1 . | Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min |
| 2 . | Refrigerated |
| 3 . | 20 rpm |
| Resin Grade | Manufacturer | Category | Trademark |
|---|---|---|---|
| SABIC® PP 578L | Saudi Basic Industries Corporation (SABIC) | PP Homopolymer | SABIC® PP |
| TARODUR 70 | Taro Plast S.p.A. | ABS | TARODUR |
| VAMPLEN 1027 V2 | Vamp Tech | PP Homopolymer | VAMPLEN |
| Evoprene™ GC 5698 | AlphaGary | SEBS | Evoprene™ GC |
| Diaterm® A27 SR GF30 | DTR S.r.l. (Develop Thermoplastic Resins) | Nylon 6 | Diaterm® |
