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Generic Epoxy - Glass\Mineral
| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | Generic |
| Trademark: | Generic |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | sptWq5_Generic-Epoxy---Glass-Mineral.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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This data represents typical values that have been calculated from all products classified as: Generic Epoxy - Glass\Mineral This information is provided for comparative purposes only. |
| General Information | |
|---|---|
| Filler / Reinforcement |
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| Physical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Specific Gravity | 1.84 to 2.02 | g/cm³ | ASTM D792 |
| Molding Shrinkage - Flow (23°C) | 0.25 to 0.50 | % | ASTM D955 |
| Mechanical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Flexural Modulus (23°C) | 13700 to 16700 | MPa | ASTM D790 |
| Compressive Strength (23°C) | 193 to 237 | MPa | ASTM D695 |
| Impact | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Notched Izod Impact (23°C) | 16 to 27 | J/m | ASTM D256 |
| Thermal | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Deflection Temperature Under Load (1.8 MPa, Unannealed) | 135 to 282 | °C | ASTM D648 |
| Thermal Conductivity (23°C) | 0.65 to 0.71 | W/m/K | ASTM C177 |
| Electrical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Dielectric Strength (23°C) | 13 to 15 | kV/mm | ASTM D149 |
| Dielectric Constant (23°C) | 3.89 to 4.80 | ASTM D150 | |
| Dissipation Factor (23°C) | 0.010 to 0.014 | ASTM D150 |
| Resin Grade | Manufacturer | Category | Trademark |
|---|---|---|---|
| TANEGUM ME/87 U2 | Crosspolimeri S.p.A. | PVC+PUR+Polyester | TANEGUM |
| Novodur® H802 | Styrolution | ABS | Novodur® |
| BorSafe™ HE3492-LS-H | Borealis AG | PE, Unspecified | BorSafe™ |
| HiFill® PP GF/M40 CC NAT | Techmer Engineered Solutions | PP, Unspecified | HiFill® |
| LEXAN™ EXL1494T resin | SABIC Innovative Plastics | PC | LEXAN™ |
