NuSil R2-6755

Category: Silicone , Silicone
Manufacturer: NuSil Technology
Trademark: NuSil
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: se9cb1_NuSil-R2-6755.pdf
PRICE: ​Order Products​ email   sales@su-jiao.com
Wechat: WECHAT
Message
As a low stress alternative for electronic packaging, NuSil Technology's silicones allow the designer to choose from a unique line of silicones for various levels of packaging. We have an extensive line of encapsulants, adhesives, and greases to choose from. These include thermally and electrically conductive silicones for Thermal Interface Materials (TIM) or for EMI and RFI shielding applications.

Benefits of Silicone for Electronics:
  • Wide Operating Temperature Range of -115 °C to 250 °C
  • Low moisture absorption, < 0.4% Typical
  • Corrosion Resistance
  • High Dielectric Strength > 500 V/mil (0.001 inch) or 20 kV/mm
  • Fillers can be added to provide thermal and electrical conductive properties
  • Low Modulus (Typically less than 5.5 MPa/800 psi)
  • Stable chemical and mechanical properties when exposed to high temperatures
  • Low Shrinkage
  • Available as gels, elastomers, film adhesives sheeting, and greases

General Purpose: Adhesives and Sealants

Comments: Better Adhesion to Polycarbonate
General Information
Features
  • Good Corrosion Resistance
  • Good Thermal Stability
  • Low Moisture Absorption
  • Low Shrinkage
Uses
  • Adhesives
  • Electrical/Electronic Applications
  • Sealants
ThermosetNominal ValueUnit
Thermoset Components
    Part A Mix Ratio by Weight: 1.0
    Part B Mix Ratio by Weight: 1.0
Additional InformationNominal ValueUnit
Cure System Platinum
Operating Temperature -115 to 260°C
Uncured PropertiesNominal ValueUnit
Color Clear/Transparent
Density 1.14g/cm³
Viscosity
    -- 11.4Pa·s
    -- 232Pa·s
    -- 337Pa·s
Curing Time (150°C)0.50hr
Cured PropertiesNominal ValueUnit
Shore Hardness (Shore A)30
Tensile Strength 5.17MPa
Tensile Elongation at Break 300%
Tear Strength 5.25kN/m
Note Message
1 .Part C
2 .Part B
3 .Part A
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