| Category: | PC+ABS , Polycarbonate + ABS |
| Manufacturer: | SABIC Innovative Plastics |
| Trademark: | LNP™ THERMOCOMP™ |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | rCgYxT_LNPTHERMOCOMPNF002compound.pdf |
| PRICE: | Order Products email sales@su-jiao.com |
| Message |
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LNP THERMOCOMP* NF002 is a compound based on PC+ABS Blend resin. Also known as: LNP* THERMOCOMP* Compound PCA-F-1002 Product reorder name: NF002 |
| General Information |
|---|
| Physical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Specific Gravity | 1.22 | g/cm³ | ASTM D792 |
| Molding Shrinkage | ASTM D955 | ||
| Flow : 24 hours | 0.40 | % | ASTM D955 |
| Transverse flow : 24 hours | 0.50 | % | ASTM D955 |
| Mechanical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Tensile Modulus 1 | 4140 | MPa | ASTM D638 |
| Tensile Strength (Break) | 65.5 | MPa | ASTM D638 |
| Tensile Elongation (Break) | 2.8 | % | ASTM D638 |
| Flexural Modulus | 3900 | MPa | ASTM D790 |
| Flexural Strength | 103 | MPa | ASTM D790 |
| Impact | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Notched Izod Impact (23°C) | 110 | J/m | ASTM D256 |
| Thermal | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Deflection Temperature Under Load (1.8 MPa, Unannealed, 3.20 mm) | 160 | °C | ASTM D648 |
| Note Message | |
|---|---|
| 1 . | 50 mm/min |
| Resin Grade | Manufacturer | Category | Trademark |
|---|---|---|---|
| RAMSTER PF300G9 | Polyram Ram-On Industries | PBT | RAMSTER |
| Quantum Composites QC-8150C | Quantum Composites Inc. | Vinyl Ester | Quantum Composites |
| Abstron IM11 | Bhansali Engineering Polymers Limited | ABS | Abstron |
| Evolue™ SP2320H | Prime Polymer Co., Ltd. | LLDPE | Evolue™ |
| Huafon HF-3695AT | Huafon Group Co., Ltd. | TPU-Polyester | Huafon |