EPO-TEK® H31D-LV

Category: Epoxy , Epoxy; Epoxide
Manufacturer: Epoxy Technology Inc.
Trademark: EPO-TEK®
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: qMuG5N_EPO-TEK-H31D-LV.pdf
PRICE: ​Order Products​ email   sales@su-jiao.com
Wechat: WECHAT
Message
A single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-electronic packaging. It is a NASA approved low outgassing epoxy. It is a lower viscosity version of EPO-TEK® H31D.
General Information
Filler / Reinforcement
  • Silver
Features
  • Electrically Conductive
  • Low to No Outgassing
Uses
  • Adhesives
  • Electrical/Electronic Applications
Agency Ratings
  • EC 1907/2006 (REACH)
  • EU 2003/11/EC
  • EU 2006/122/EC
RoHS Compliance
  • RoHS Compliant
Forms
  • Paste
PhysicalNominal ValueUnit
Ion Type
    Cl- 17ppm
    K+ 33ppm
    Na+ 145ppm
Particle Size < 20.0µm
Additional InformationNominal ValueUnit
Degradation Temperature 456°C
Die Shear Strength - >5 kg (23°C) 11.7MPa
Operating Temperature
    Continuous -55 to 250°C
    Intermittent -55 to 350°C
Storage Modulus (23°C) 2.14GPa
Thixotropic Index 1.60
Weight Loss on Heating
    200°C < 0.50%
    300°C 0.080%
ThermalNominal ValueUnit
Glass Transition Temperature 1> 110°C
CLTE - Flow
    -- 23.5E-5cm/cm/°C
    -- 31.4E-4cm/cm/°C
Thermal Conductivity 0.89W/m/K
ThermosetNominal ValueUnit
Shelf Life 426wk
Uncured PropertiesNominal ValueUnit
Color Silver
Density 2.12g/cm³
Viscosity 5(23°C)10 to 15Pa·s
Curing Time (150°C)1.0hr
Pot Life 40000min
Cured PropertiesNominal ValueUnit
Shore Hardness (Shore D)85
Lap Shear Strength (23°C)9.31MPa
Volume Resistivity (23°C)< 8.0E-3ohms·cm
Note Message
1 .Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-250°C @ 20°C/Min
2 .Below Tg
3 .Above Tg
4 .Refrigerated
5 .20 rpm
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