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EPO-TEK® H31D-LV
| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | Epoxy Technology Inc. |
| Trademark: | EPO-TEK® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | qMuG5N_EPO-TEK-H31D-LV.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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| A single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-electronic packaging. It is a NASA approved low outgassing epoxy. It is a lower viscosity version of EPO-TEK® H31D. |
| General Information | |
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| Filler / Reinforcement |
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| Features |
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| Uses |
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| Agency Ratings |
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| RoHS Compliance |
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| Forms |
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| Physical | Nominal Value | Unit | |
|---|---|---|---|
| Ion Type | |||
| Cl- | 17 | ppm | |
| K+ | 33 | ppm | |
| Na+ | 145 | ppm | |
| Particle Size | < 20.0 | µm |
| Additional Information | Nominal Value | Unit | |
|---|---|---|---|
| Degradation Temperature | 456 | °C | |
| Die Shear Strength - >5 kg (23°C) | 11.7 | MPa | |
| Operating Temperature | |||
| Continuous | -55 to 250 | °C | |
| Intermittent | -55 to 350 | °C | |
| Storage Modulus (23°C) | 2.14 | GPa | |
| Thixotropic Index | 1.60 | ||
| Weight Loss on Heating | |||
| 200°C | < 0.50 | % | |
| 300°C | 0.080 | % |
| Thermal | Nominal Value | Unit | |
|---|---|---|---|
| Glass Transition Temperature 1 | > 110 | °C | |
| CLTE - Flow | |||
| -- 2 | 3.5E-5 | cm/cm/°C | |
| -- 3 | 1.4E-4 | cm/cm/°C | |
| Thermal Conductivity | 0.89 | W/m/K |
| Thermoset | Nominal Value | Unit | |
|---|---|---|---|
| Shelf Life 4 | 26 | wk |
| Uncured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Color | Silver | ||
| Density | 2.12 | g/cm³ | |
| Viscosity 5(23°C) | 10 to 15 | Pa·s | |
| Curing Time (150°C) | 1.0 | hr | |
| Pot Life | 40000 | min |
| Cured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Shore Hardness (Shore D) | 85 | ||
| Lap Shear Strength (23°C) | 9.31 | MPa | |
| Volume Resistivity (23°C) | < 8.0E-3 | ohms·cm |
| Note Message | |
|---|---|
| 1 . | Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-250°C @ 20°C/Min |
| 2 . | Below Tg |
| 3 . | Above Tg |
| 4 . | Refrigerated |
| 5 . | 20 rpm |
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