Category: | Epoxy , Epoxy; Epoxide |
Manufacturer: | KYOCERA Chemical Corporation |
Trademark: | KYOCERA |
Fillers: | - |
Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
Delivery Terms | FOB, CIF, DAP, DAT, DDP |
PDF: | pzzKxo_KYOCERA-KE-850SH.pdf ![]() |
PRICE: | Order Products email sales@su-jiao.com |
Message |
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Developed for Power Device Package that needs Good Heat Dissipation Through Molding Compound. Strong Points
Application
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General Information | |
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Features |
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Uses |
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Physical | Nominal Value | Unit | |
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Specific Gravity | 2.19 | g/cm³ | |
Spiral Flow | 35.0 | cm |
Thermal | Nominal Value | Unit | |
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Glass Transition Temperature | 175 | °C | |
CLTE - Flow | |||
-- 1 | 2.2E-5 | cm/cm/°C | |
-- 2 | 5.9E-5 | cm/cm/°C | |
Thermal Conductivity | 2.3 | W/m/K |
Uncured Properties | Nominal Value | Unit | |
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Gel Time | 0.42 | min |
Note Message | |
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1 . | Alpha 1 |
2 . | Alpha 2 |
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