Category: | Epoxy , Epoxy; Epoxide |
Manufacturer: | Epoxy Technology Inc. |
Trademark: | EPO-TEK® |
Fillers: | - |
Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
Delivery Terms | FOB, CIF, DAP, DAT, DDP |
PDF: | oKfX2h_EPO-TEK-OE121-Black.pdf ![]() |
PRICE: | Order Products email sales@su-jiao.com |
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A two component, low temperature curing epoxy adhesive designed for semiconductor flip chip underfill. It is color coded black for visual ID during the underfilling process. It may also be used for adhesive, potting, sealing, and encapsulation applications found within the electronics, medical, and optical industries. It is a black version of EPO-TEK® OE121. |
General Information | |
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Uses |
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Agency Ratings |
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RoHS Compliance |
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Forms |
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Processing Method |
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Physical | Nominal Value | Unit | |
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Ion Type | |||
Cl- | 62 | ppm | |
K+ | 1 | ppm | |
Na+ | 16 | ppm | |
NH4+ | 15 | ppm | |
Particle Size | < 20.0 | µm |
Additional Information | Nominal Value | Unit | |
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Degradation Temperature | 350 | °C | |
Die Shear Strength - >15 kg (23°C) | 35.2 | MPa | |
Operating Temperature | |||
Continuous | -55 to 200 | °C | |
Intermittent | -55 to 275 | °C | |
Storage Modulus (23°C) | 1.71 | GPa | |
Weight Loss on Heating | |||
200°C | 1.2 | % | |
250°C | 1.7 | % | |
300°C | 3.9 | % |
Thermal | Nominal Value | Unit | |
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Glass Transition Temperature 1 | > 55.0 | °C | |
CLTE - Flow | |||
-- 2 | 4.3E-5 | cm/cm/°C | |
-- 3 | 1.6E-4 | cm/cm/°C |
Optical | Nominal Value | Unit | |
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Transmittance (340 to 1260 nm) | < 1.0 | % |
Thermoset | Nominal Value | Unit | |
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Thermoset Components | |||
Part A | Mix Ratio by Weight: 100 | ||
Part B | Mix Ratio by Weight: 35 | ||
Shelf Life (23°C) | 52 | wk |
Uncured Properties | Nominal Value | Unit | |
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Color | |||
-- 4 | Black | ||
-- 5 | Clear/Transparent | ||
Density | |||
Part B | 0.958 | g/cm³ | |
Part A | 1.18 | g/cm³ | |
Viscosity 6(23°C) | 0.30 to 0.50 | Pa·s | |
Curing Time (90°C) | > 1.0 | hr | |
Pot Life | 300 | min |
Cured Properties | Nominal Value | Unit | |
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Shore Hardness (Shore D) | 81 | ||
Lap Shear Strength (23°C) | 11.8 | MPa | |
Relative Permittivity (1 kHz) | 3.67 | ||
Volume Resistivity (23°C) | > 1.0E+13 | ohms·cm | |
Dissipation Factor (1 kHz) | 0.012 |
Note Message | |
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1 . | Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min |
2 . | Below Tg |
3 . | Above Tg |
4 . | Part A |
5 . | Part B |
6 . | 100 rpm |
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