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Compoceran E103D
| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | Arakawa Chemical Industries, Ltd. |
| Trademark: | Compoceran |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | oGUR8u_Compoceran-E103D.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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COMPOCERAN E (Epoxy Resin Silica Hybrid) Base Resin
Characteristics
|
| General Information |
|---|
| Physical | Nominal Value | ||
|---|---|---|---|
| Functional Group - Silica | 3.00 |
| Additional Information | Nominal Value | Unit | |
|---|---|---|---|
| Silica Content | 35.0 | wt% | |
| Solvents | MEK |
| Uncured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Solids Content | 50 | % | |
| Viscosity (25°C) | 0.015 | Pa·s |
| Resin Grade | Manufacturer | Category | Trademark |
|---|---|---|---|
| Rhelon G2030HR-01 | RheTech, Inc. | Nylon 66 | Rhelon |
| NEXUS ABS ABSLG5035 | Nexus Resin Group, LLC. | ABS | NEXUS ABS |
| NYLAFORCE® B 50 | LEIS Polytechnik - polymere Werkstoffe GmbH | Nylon 6 | NYLAFORCE® |
| DOW™ Electrical & Telecommunications HFDA-9217 BK | The Dow Chemical Company | LDPE | DOW™ Electrical & Telecommunications |
| Plaskon CMU-870-2C | Cookson Electronics - Semiconductor Products | Epoxy | Plaskon |
