Category: | Epoxy , Epoxy; Epoxide |
Manufacturer: | Epoxy Technology Inc. |
Trademark: | EPO-TEK® |
Fillers: | - |
Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
Delivery Terms | FOB, CIF, DAP, DAT, DDP |
PDF: | nmWZ7G_EPO-TEK-TD1001.pdf ![]() |
PRICE: | Order Products email sales@su-jiao.com |
Message |
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EPO-TEK® TD1001 is a single component, thermally conductive, electrically insulating epoxy designed for low stress semiconductor and electronics packaging. |
General Information | |
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Features |
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Uses |
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Agency Ratings |
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RoHS Compliance |
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Forms |
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Physical | Nominal Value | Unit | |
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Particle Size | < 20.0 | µm |
Additional Information | Nominal Value | Unit | Test Method |
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Degradation Temperature | 436 | °C | TGA |
Die Shear Strength - >15 kg (23°C) | 35.2 | MPa | |
Operating Temperature | |||
Continuous | -55 to 225 | °C | |
Intermittent | -55 to 325 | °C | |
Storage Modulus (23°C) | 1.98 | GPa | |
Thixotropic Index | 4.10 | ||
Weight Loss on Heating | |||
200°C | < 0.050 | % | |
250°C | 0.14 | % | |
300°C | 0.44 | % |
Thermal | Nominal Value | Unit | |
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Glass Transition Temperature 1 | > 40.0 | °C | |
CLTE - Flow | |||
-- 2 | 5.7E-5 | cm/cm/°C | |
-- 3 | 2.1E-4 | cm/cm/°C | |
Thermal Conductivity | 0.77 | W/m/K |
Thermoset | Nominal Value | Unit | Test Method |
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Shelf Life (-40°C) | 52 | wk |
Uncured Properties | Nominal Value | Unit | Test Method |
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Color | White | ||
Density | 1.20 | g/cm³ | |
Viscosity 4(23°C) | 10 to 22 | Pa·s | |
Curing Time (125°C) | > 1.0 | hr | |
Pot Life | 40000 | min |
Cured Properties | Nominal Value | Unit | Test Method |
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Shore Hardness (Shore D) | 85 | ||
Lap Shear Strength (23°C) | > 13.8 | MPa | |
Relative Permittivity (1 kHz) | 3.12 | ||
Volume Resistivity (23°C) | > 2.0E+13 | ohms·cm | |
Dissipation Factor (1 kHz) | 0.010 |
Note Message | |
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1 . | Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min |
2 . | Below Tg |
3 . | Above Tg |
4 . | 5 rpm |
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