CELLAMP® 5100

Category: SIS , Styrene Isoprene Styrene Block Copolymer
Manufacturer: Microcell Composite Company
Trademark: CELLAMP®
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: nhqGRa_CELLAMP-5100.pdf
PRICE: ​Order Products​ email   sales@su-jiao.com
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CELLAMP® (Microcell + Damp)

For producing foaming boards with damping properties, which yield the best efficiency between -10°C and room temperature.

  • Pre-formulated & pre-foamed SIS compounds in pellet form
  • To be melt-processed with traditional rubber and thermoplastics such as EPDM, IIR, NBR, Silicone, PE, EVA by injection, extrusion or hot pressing
  • Used for making foamed articles or componenets.

Features:
  • Closed microcellular structure
  • Resilience / Elasticity
  • Damping properties
  • Light weight
  • Soft-touch /Tactile feel
  • Shape retention memery
General Information
Features
  • Foamable
  • High Elasticity
  • Noise Damping
  • Resilient
  • Soft
Uses
  • Foamed Insulation Board
Forms
  • Pellets
Processing Method
  • Extrusion
  • Injection Molding
  • Press Molding
PhysicalNominal ValueUnit
Density 0.930g/cm³
Melt Mass-Flow Rate (MFR) (190°C/5.0 kg)14g/10 min
HardnessNominal ValueUnit
Durometer Hardness (Shore A)79
ElastomersNominal ValueUnit
Tensile Strength 10.1MPa
Tensile Elongation (Break)620%
Tear Strength 38.5kN/m
Resin Grade Manufacturer Category Trademark
Resiprene® 3045 Resirene, S.A. de C.V. TPE Resiprene®
Siloxane Masterbatch MB50-314 Multibase, A Dow Corning Company Siloxane, UHMW Siloxane Masterbatch
Alcryn® 4060 BK Advanced Polymer Alloys MPR Alcryn®
ELASTOSIL® P 7670 A/B Wacker Chemie AG Silicone ELASTOSIL® P
neogol® 35 P UG API SpA TPO (POE) neogol®