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Ablebond 84-1LMISR4
| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | Henkel Ablestik |
| Trademark: | Ablebond |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | nGaEQn_Ablebond-84-1LMISR4.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
Wechat:
| Message |
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| ABLEBOND® 84-1LMISR4 electrically conductive die attach adhesive has been formulated for use in high throughput, automatic die attach equipment. The rheology of ABLEBOND 84-1LMISR4 adhesive allows minimum adhesive dispense and die put down dwell times, without tailing or stringing problems. The unique combination of adhesive properties makes this material one the most widely used die attach materials in the semiconductor industry. |
| General Information | |
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| Filler / Reinforcement |
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| Features |
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| Uses |
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| Appearance |
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| Physical | Nominal Value | Unit | |
|---|---|---|---|
| Water Absorption 1(Saturation, 85°C) | 0.60 | % | |
| pH | 6.0 | ||
| Weight | |||
| Loss : 300°C | 0.35 | % | |
| Loss on Cure 2 | 5.3 | % |
| Additional Information | Nominal Value | Unit | |
|---|---|---|---|
| Ionic Chloride | < 20 | ppm | |
| Ionic Potassium | < 10 | ppm | |
| Ionic Sodium | < 10 | ppm | |
| Thixotropic Index 3 | 5.60 | ||
| Water Extract Conductivity | 13.0 | µS/cm |
| Mechanical | Nominal Value | Unit | |
|---|---|---|---|
| Tensile Modulus | |||
| -65°C, 0.500 mm | 4400 | MPa | |
| 25°C, 0.500 mm | 3900 | MPa | |
| 150°C, 0.500 mm | 2000 | MPa | |
| 250°C, 0.500 mm | 300 | MPa |
| Thermal | Nominal Value | Unit | |
|---|---|---|---|
| Glass Transition Temperature | 120 | °C | |
| CLTE - Flow | |||
| < 120°C | 4.0E-5 | cm/cm/°C | |
| > 120°C | 1.5E-4 | cm/cm/°C | |
| Thermal Conductivity | 2.5 | W/m/K |
| Electrical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Volume Resistivity | 1.0E-4 | ohms·cm | IEC 60093 |
| Thermoset | Nominal Value | Unit | |
|---|---|---|---|
| Pot Life (25°C) | 1100 | min | |
| Shelf Life (-40°C) | 52 | wk | |
| Thermoset Mix Viscosity 4 | 8000 | cP | |
| Demold Time (175°C) | 60 | min |
| Note Message | |
|---|---|
| 1 . | 85%RH |
| 2 . | 10 x 10 mm Si die on glass slide |
| 3 . | Viscosity @ 0.5/Viscosity @ 5 rpm |
| 4 . | Brookfield CP51 @ 5 rpm |
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