Epoxies, Ect. 20-3060

Category: Epoxy , Epoxy; Epoxide
Manufacturer: Epoxies, Etc.
Trademark: Epoxies, Ect.
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: n2Chw4_Epoxies-Ect-20-3060.pdf
PRICE: ​Order Products​ email   sales@su-jiao.com
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Message
20-3060 is a general purpose, low viscosity epoxy potting and encapsulating resin system. This is a 100% solids system. It therefore does not contain any solvents.

20-3060 is a filled system resulting in excellent dimensional stability and extremely low shrinkage. 20-3060 is characterized by exceptional resistance to impact, vibration, and hermal shock. In addition, this versatile resin system is machinable and ideal for use with meter mix dispensing equipment.

Due to its high purity, 20-3060 offers the ultimate in physical, thermal and electrical insulation properties. The cured polymer exhibits excellent resistance to chemicals, moisture, solvents and environmental exposure.

20-3060 is recommended for applications requiring the optimum in over-all properties and where rigid or flexible wire leads protrude directly from the encapsulant. This system eliminates microscopic cracking when leads are flexed. It also adheres extremely well to lead materials, such as vinyl, neoprene, natural rubber, etc...

20-3060 has found wide acceptance as an encapsulant for applications such as transformers, coils, chokes, solenoids, resistors, modules, microcircuitry, resistors, capacitors, etc... 20-3060 has been formulated for ease in handling and its low viscosity aids in pouring, filling voids and air pockets. In addition, the fillers in 20-3060 have been dispersed to minimize any heavy settling.
General Information
Features
  • Electrically Insulating
  • General Purpose
  • Good Adhesion
  • Good Chemical Resistance
  • Good Dimensional Stability
  • Good Flexibility
  • Good Impact Resistance
  • Low Shrinkage
  • Low to No Water Absorption
  • Low Viscosity
  • Machinable
  • Shock Resistant
Uses
  • Adhesives
  • General Purpose
Appearance
  • Black
Processing Method
  • Encapsulating
  • Potting
PhysicalNominal ValueUnit
Molding Shrinkage - Flow 0.50%
ThermalNominal ValueUnit
Thermal Conductivity 0.43W/m/K
ThermosetNominal ValueUnit
Thermoset Mix Viscosity (25°C)10000cP
Additional InformationNominal ValueUnit
Operating Temperature -50.0 to 135°C
Uncured PropertiesNominal ValueUnit
Color Black
Density 1(25°C)1.50g/cm³
Cured PropertiesNominal ValueUnit
Shore Hardness (Shore D)82
Tensile Strength 68.9MPa
Compression Strength 155MPa
Electric Strength 18kV/mm
Relative Permittivity (100 Hz)4.51
Volume Resistivity 4.0E+14ohms·cm
Note Message
1 .Resin
Resin Grade Manufacturer Category Trademark
RTP 6002-45A RTP Company TPE RTP
SILPURAN® 6610/50 A/B Wacker Chemie AG Silicone SILPURAN®
tefanyl® VR VRGR 804 Mitsubishi Chemical Performance Polymers, Inc. PVC, Rigid tefanyl® VR
Texin® RxT65D Covestro - PUR TPU-Polyether Texin®
Toyolac® VX10-X01 Toray Resin Company ABS+PBT Toyolac®