Order Products : sales@su-jiao.com

KYOCERA KE-1150

Category:	Epoxy , Epoxy; Epoxide
Manufacturer:	KYOCERA Chemical Corporation
Trademark:	KYOCERA
Fillers:	-
Ports:	Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms	FOB, CIF, DAP, DAT, DDP
PDF:	mvPryE_KYOCERA-KE-1150.pdf
PRICE:	Order Products email sales@su-jiao.com

Wechat: WECHAT

WECHAT

Message

Special Epoxy Molding Compounds Optimizing Warpage and Applicable to Fine Pitch Wire for BGA Package

Strong Points

Less Warpage in All Types of Area Array Packages due to High Tg Characteristic.

Applicable to Fine Pitch Wire Bonding with Good Wire Sweep Performance.

Achieve High Yield after Molding due to Excellent Moldability that allows its application to MAP.

Application

Standard P-BGA, HS-BGA and LGA Package.

Multi Chip Module (Stacked or Side by Side Layout)

IC Card, Memory Card etc.

Low Alpha Ray Type: KE-2150

General Information
Features	Good Moldability
Uses	Electrical/Electronic Applications

Physical	Nominal Value	Unit
Specific Gravity	2.00	g/cm³
Spiral Flow	190	cm
Solution Viscosity	5000	mPa·s

Mechanical	Nominal Value	Unit
Flexural Modulus	18000	MPa
Flexural Strength	150	MPa

Thermal	Nominal Value	Unit
Glass Transition Temperature	185	°C
CLTE - Flow
-- ¹	1.0E-5	cm/cm/°C
-- ²	4.5E-5	cm/cm/°C

Note Message
1 .	Alpha 1
2 .	Alpha 2

Resin Grade	Manufacturer	Category	Trademark
Maxxam™ MAXBATCH YM-618.G001-1000	PolyOne Corporation	PP, Unspecified	Maxxam™
Resinoid 1321	Resinoid Engineering Corporation	Phenolic	Resinoid
Visiloy™ 2615R11U2	Technical Polymers, LLC	PC+PBT	Visiloy™
DOW™ 8818 YL-CF	The Dow Chemical Company	MDPE	DOW™
FRAGOM LCX/3013	Crosspolimeri S.p.A.	Polyolefin, Unspecified	FRAGOM