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BONDYRAM® 1001
| Category: | PP Homopolymer , Polypropylene Homopolymer |
| Manufacturer: | Polyram Ram-On Industries |
| Trademark: | BONDYRAM® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | mZSRCI_BONDYRAM-1001.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
Wechat:
| Message |
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| Maleic Anhydride Modified Homo Polypropylene. |
| General Information | |
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| Features |
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| RoHS Compliance |
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| Physical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Specific Gravity | 0.900 | g/cm³ | ASTM D792, ISO 1183 |
| Melt Mass-Flow Rate (MFR) (190°C/2.16 kg) | 100 | g/10 min | ASTM D1238, ISO 1133 |
| Thermal | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Melting Temperature | 160 | °C | ASTM D3417, ISO 11357-3 |
| Resin Grade | Manufacturer | Category | Trademark |
|---|---|---|---|
| NEXT PCR PA66 GM35-300PCR | NEXT Specialty Resins, Inc. | Nylon 66 | NEXT PCR |
| Next Nylon 6 Prime Series NST35-01BK | Next Polymers Ltd. | Nylon 6 | Next Nylon 6 Prime Series |
| Nipoflex® 750 | TOSOH Corporation | EVA | Nipoflex® |
| Boda BDF-KR2852 | Chenguang Fluoro & Silicone Elastomers Co., Ltd. | Fluorelastomer | Boda |
| HiFill® POM 0169 B LE | Techmer Engineered Solutions | Acetal (POM) Copolymer | HiFill® |
