DOWLEX™ NG 5056G

Category: LLDPE , Polyethylene Resin
Manufacturer: The Dow Chemical Company
Trademark: DOWLEX™
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: lli8UC_DOWLEX-NG-5056G.pdf
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DOWLEX™NG 5056G polyethylene resin is a new generation of linear low density polyethylene resin, used for high-quality blown film processing, the processing requires a combination of excellent optical properties, tear strength and heat sealing, as well as very good toughness/stiffness between the balance. DOWLEX NG 5056G polyethylene resin has a very low crystal point level, making it very suitable for composite films and other special packaging.

Note: When applied to the application field of contact food, DOWLEX NG 5056G polyethylene resin should comply with the U.S. Food and Drug Administration when it is unmodified and the processing process follows the requirements of good manufacturing practices. The requirements of the 177.1520 and the requirements of the food contact regulations of most European countries. Please contact your nearest Dow representative for proof of compliance with the Food Contact Act. The purchaser remains responsible for determining whether the use of its products complies with all relevant regulations.

Application field:
  • high transparency paper towel outer package
  • fresh food bag
  • food packaging film
  • composite film
General Information
Agency Ratings
  • FDA 21 CFR 177.1520
Forms
  • Particle
PhysicalNominal ValueUnitTest Method
Specific Gravity 10.919g/cm³ASTM D792
Melt Mass-Flow Rate (MFR) 2(190°C/2.16 kg)1.1g/10 minISO 1133
FilmsNominal ValueUnitTest Method
Film Thickness - Tested 50µm
Film Puncture Energy 3(50 µm)3.50JASTM D5748
Film Puncture Force 4(50 µm)54.0NASTM D5748
Tensile Modulus 5ISO 527-3
    2% secant, MD : 50 µm 198MPaISO 527-3
    2% secant, TD : 50 µm 238MPaISO 527-3
Tensile Stress 6ISO 527-3
    MD : Yield, 50 µm 7.50MPaISO 527-3
    TD : Yield, 50 µm 8.00MPaISO 527-3
    MD : Break, 50 µm 38.0MPaISO 527-3
    TD : Break, 50 µm 37.0MPaISO 527-3
Tensile Elongation 7ISO 527-3
    MD : Break, 50 µm 810%ISO 527-3
    TD : Break, 50 µm 920%ISO 527-3
Dart Drop Impact 8(50 µm)450gISO 7765-1/A
Elmendorf Tear Strength 9ASTM D1922
    MD : 50 µm 890gASTM D1922
    TD : 50 µm 1100gASTM D1922
ThermalNominal ValueUnitTest Method
Vicat Softening Temperature 10104°CASTM D1525
OpticalNominal ValueUnitTest Method
Gloss 11(45°, 50.0 µm)61ASTM D2457
Haze 12(50.0 µm)8.9%ISO 14782
ExtrusionNominal ValueUnit
Melt Temperature 190 - 240°C
Extrusion instructions
管形薄膜挤出的制造条件: 熔体温度:190 至 240°C。 放大比范围:1.5 至 3:1。 建议的厚度范围:10 至 150 µm。
Note Message
1 .Compression molding
2 .Compression molding
3 .Blow molded film extruded at 235°C, 50 microns, 2.5 BUR, 1.55mm die gap.
4 .Blow molded film extruded at 235°C, 50 microns, 2.5 BUR, 1.55mm die gap.
5 .Blow molded film extruded at 235°C, 50 microns, 2.5 BUR, 1.55mm die gap.
6 .Blow molded film extruded at 235°C, 50 microns, 2.5 BUR, 1.55mm die gap.
7 .Blow molded film extruded at 235°C, 50 microns, 2.5 BUR, 1.55mm die gap.
8 .Blow molded film extruded at 235°C, 50 microns, 2.5 BUR, 1.55mm die gap.
9 .Blow molded film extruded at 235°C, 50 microns, 2.5 BUR, 1.55mm die gap.
10 .Compression molding
11 .Blow molded film extruded at 235°C, 50 microns, 2.5 BUR, 1.55mm die gap.
12 .Blow molded film extruded at 235°C, 50 microns, 2.5 BUR, 1.55mm die gap.
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