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EPO-TEK® E3037-LV
| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | Epoxy Technology Inc. |
| Trademark: | EPO-TEK® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | l3xVfP_EPO-TEK-E3037-LV.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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A single component, silver-filled and electrically conductive adhesive designed for semiconductor die attach and bonding of SMDs for hybrid microelectronic packaging. Formerly EP108-LV |
| General Information | |
|---|---|
| Filler / Reinforcement |
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| Features |
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| Uses |
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| Agency Ratings |
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| RoHS Compliance |
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| Forms |
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| Physical | Nominal Value | Unit | |
|---|---|---|---|
| Ion Type | |||
| Cl- | 172 | ppm | |
| K+ | 45 | ppm | |
| NH4+ | 65 | ppm | |
| Particle Size | < 20.0 | µm |
| Additional Information | Nominal Value | Unit | |
|---|---|---|---|
| Degradation Temperature | 342 | °C | |
| Die Shear Strength - >5 kg (23°C) | 11.7 | MPa | |
| Operating Temperature | |||
| Continuous | -55 to 175 | °C | |
| Intermittent | -55 to 275 | °C | |
| Storage Modulus (23°C) | 4.30 | GPa | |
| Thixotropic Index | 2.85 | ||
| Weight Loss on Heating | |||
| 200°C | 0.16 | % | |
| 250°C | 0.25 | % | |
| 300°C | 0.32 | % |
| Thermal | Nominal Value | Unit | |
|---|---|---|---|
| Glass Transition Temperature 1 | > 90.0 | °C | |
| CLTE - Flow | |||
| -- 2 | 3.5E-5 | cm/cm/°C | |
| -- 3 | 1.2E-4 | cm/cm/°C | |
| Thermal Conductivity | 0.69 | W/m/K |
| Thermoset | Nominal Value | Unit | |
|---|---|---|---|
| Shelf Life (-40°C) | 52 | wk |
| Uncured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Color | Silver | ||
| Density | 2.84 | g/cm³ | |
| Viscosity 4(23°C) | 9.5 to 18 | Pa·s | |
| Curing Time (150°C) | 1.0 | hr | |
| Pot Life | 30000 | min |
| Cured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Shore Hardness (Shore D) | 73 | ||
| Lap Shear Strength (23°C) | 13.6 | MPa | |
| Volume Resistivity (23°C) | < 5.0E-4 | ohms·cm |
| Note Message | |
|---|---|
| 1 . | Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min |
| 2 . | Below Tg |
| 3 . | Above Tg |
| 4 . | 10 rpm |
| Resin Grade | Manufacturer | Category | Trademark |
|---|---|---|---|
| REDI-LINK™ DFDA-5440 NT | The Dow Chemical Company | PE, Unspecified | REDI-LINK™ |
| TAISOX 6534F | Formosa Plastics Corporation | LDPE | TAISOX |
| Adell PP R-19 | Adell Plastics, Inc. | PP Homopolymer | Adell PP |
| Keyflex® TO 1075AR | LG Chem Ltd. | TPC-ET | Keyflex® TO |
| MAJORIS AT200 | AD majoris | PP, Unspecified | MAJORIS |
