Category: | Epoxy , Epoxy; Epoxide |
Manufacturer: | Devcon |
Trademark: | Devcon |
Fillers: | - |
Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
Delivery Terms | FOB, CIF, DAP, DAT, DDP |
PDF: | kSrP8e_Devcon-HV-Tile-Adhesive.pdf ![]() |
PRICE: | Order Products email sales@su-jiao.com |
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High-strength towelable adhesive compound designed for bonding ceramic tile to vertical, curved and overhead surfaces and repariing ceramic tile surfaces. Intended Use:
Product Features:
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General Information | |
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Features |
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Uses |
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Appearance |
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Physical | Nominal Value | Unit | Test Method |
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Specific Volume | 0.686 | cm³/g | |
Solid content- by Volume | 100 | % |
Additional Information | Nominal Value | Unit | Test Method |
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Temperature Resistance | 93 | °C | |
Tensile Shear Adhesion | 12.6 | MPa | ASTM D1002 |
Physical | Nominal Value | Unit | Test Method |
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Density 1 | 1.40 | g/cm³ | |
Molding Shrinkage - Flow | 0.10 | % | ASTM D2566 |
Hardness | Nominal Value | Unit | Test Method |
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Durometer Hardness (Shore D) | 81 | ASTM D2240 |
Mechanical | Nominal Value | Unit | Test Method |
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Tensile Modulus | 5520 | MPa | ASTM D638 |
Flexural Strength | 37.2 | MPa | ASTM D790 |
Compressive Strength | 81.4 | MPa | ASTM D695 |
Thermal | Nominal Value | Unit | Test Method |
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CLTE - Flow | 2.5E-5 | cm/cm/°C | ASTM D696 |
Thermal Conductivity | 0.52 | W/m/K | ASTM C177 |
Electrical | Nominal Value | Unit | Test Method |
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Dielectric Strength | 13 | kV/mm | ASTM D149 |
Dielectric Constant | 45.0 | ASTM D150 |
Thermoset | Nominal Value | Unit | Test Method |
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Thermoset Components | |||
Component a | Mixing ratio by weight: 1.1 Mixing ratio by capacity: 1.0 | ||
Component B | Mixing ratio by weight: 1.0 Mixing ratio by capacity: 1.0 | ||
Pot Life (24°C) | 35 | min |
Additional Information | Nominal Value | Unit | Test Method |
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Cured 7 days @ 75°F |
Uncured Properties | Nominal Value | Unit | Test Method |
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Curing Time | 8.0 | hr |
Note Message | |
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1 . | Cured |
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