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Devcon HV Tile Adhesive
| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | Devcon |
| Trademark: | Devcon |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | kSrP8e_Devcon-HV-Tile-Adhesive.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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High-strength towelable adhesive compound designed for bonding ceramic tile to vertical, curved and overhead surfaces and repariing ceramic tile surfaces. Intended Use:
Product Features:
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| General Information | |
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| Uses |
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| Appearance |
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| Physical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Specific Volume | 0.686 | cm³/g | |
| Solid content- by Volume | 100 | % |
| Additional Information | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Temperature Resistance | 93 | °C | |
| Tensile Shear Adhesion | 12.6 | MPa | ASTM D1002 |
| Physical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Density 1 | 1.40 | g/cm³ | |
| Molding Shrinkage - Flow | 0.10 | % | ASTM D2566 |
| Hardness | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Durometer Hardness (Shore D) | 81 | ASTM D2240 |
| Mechanical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Tensile Modulus | 5520 | MPa | ASTM D638 |
| Flexural Strength | 37.2 | MPa | ASTM D790 |
| Compressive Strength | 81.4 | MPa | ASTM D695 |
| Thermal | Nominal Value | Unit | Test Method |
|---|---|---|---|
| CLTE - Flow | 2.5E-5 | cm/cm/°C | ASTM D696 |
| Thermal Conductivity | 0.52 | W/m/K | ASTM C177 |
| Electrical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Dielectric Strength | 13 | kV/mm | ASTM D149 |
| Dielectric Constant | 45.0 | ASTM D150 |
| Thermoset | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Thermoset Components | |||
| Component a | Mixing ratio by weight: 1.1 Mixing ratio by capacity: 1.0 | ||
| Component B | Mixing ratio by weight: 1.0 Mixing ratio by capacity: 1.0 | ||
| Pot Life (24°C) | 35 | min |
| Additional Information | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Cured 7 days @ 75°F |
| Uncured Properties | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Curing Time | 8.0 | hr |
| Note Message | |
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| 1 . | Cured |
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|---|---|---|---|
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| EPO-TEK® OG154-1 | Epoxy Technology Inc. | Epoxy | EPO-TEK® |
| Hanwha Total PE P200Y50 | HANWHA TOTAL PETROCHEMICALS Co., Ltd. | HDPE | Hanwha Total PE |
| LEXAN™ OQ4320R resin | SABIC Innovative Plastics | PC | LEXAN™ |
