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Romiloy® 8170
| Category: | ASA+PC , Acrylonitrile Styrene Acrylate + PC |
| Manufacturer: | ROMIRA GmbH |
| Trademark: | Romiloy® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | kP7rNh_Romiloy8170.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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Romiloy®8170 is an acrylonitrile-styrene-acrylate PC (ASA PC) material,. This product is available in Europe,. Romiloy®The main features of the 8170 are:
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| General Information | |
|---|---|
| Additive |
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| Features |
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| Physical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Density (23°C) | 1.18 | g/cm³ | ISO 1183 |
| Melt Mass-Flow Rate (MFR) | ISO 1133 | ||
| 240°C/5.0 kg | 25 | g/10 min | ISO 1133 |
| 260°C/5.0 kg | 40 | g/10 min | ISO 1133 |
| Molding Shrinkage (23°C) | 0.40 - 0.70 | % | ISO 294-4 |
| Mechanical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Tensile Modulus (23°C) | 2400 | MPa | ISO 527-2/1 |
| Tensile Stress (23°C) | 65.0 | MPa | ISO 527-2/50 |
| Tensile Strain (Break, 23°C) | 30 | % | ISO 527-2/50 |
| Flexural Modulus 1(23°C) | 2600 | MPa | ISO 178 |
| Flexural Stress 2(23°C) | 98.0 | MPa | ISO 178 |
| Impact | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Charpy Notched Impact Strength (23°C) | 21 | kJ/m² | ISO 179/1eA |
| Charpy Unnotched Impact Strength (23°C) | No Break | ISO 179/1eU |
| Thermal | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Heat Deflection Temperature (1.8 MPa, Unannealed) | 76.0 | °C | ISO 75-2/A |
| Vicat Softening Temperature | 102 | °C | ISO 306/B50 |
| Flammability | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Flame Rating (1.5 mm) | V-0 | UL 94 | |
| Glow Wire Flammability Index (3.0 mm) | 850 | °C | IEC 60695-2-12 |
| Note Message | |
|---|---|
| 1 . | 2.0 mm/min |
| 2 . | 2.0 mm/min |
| Resin Grade | Manufacturer | Category | Trademark |
|---|---|---|---|
| TECHNO ABS F1350(D4) | Techno Polymer Co, Ltd. | ABS | TECHNO ABS |
| Abstron MIF45EP | Bhansali Engineering Polymers Limited | ABS | Abstron |
| EVAL™ E171 | Kuraray Co., Ltd. | EVOH | EVAL™ |
| Plaskon MUF-2C | Cookson Electronics - Semiconductor Products | Epoxy | Plaskon |
| LEXAN™ LUX7632C resin | SABIC Innovative Plastics | PC | LEXAN™ |
