Plaskon MUF-2A LAR Datasheet,Epoxy,Cookson Electronics - Semiconductor Products-SHANGHAI SUSHENG

Message
This material is an epoxy molding compound for high temperature, lead-free reflow in low alpha applications. It is designed to withstand more demanding requirements in moisture performance, occasioned by the higher IR reflow temperatures required for processing lead-free packages. It is a highly filled, hybrid resin developed to pass JEDEC Level 2A at 260°C IR reflow temperature. It is a "green" compound with no halogens and a lower Tg than multifunctional materials.

General Information
Features	Semi-conductive Low warpage Workability, good
Forms	Liquid
Processing Method	Resin transfer molding

Physical	Nominal Value	Unit	Test Method
Specific Gravity	1.89	g/cm³	ASTM D792
Molding Shrinkage - Flow	0.050	%	ASTM D955

Mechanical	Nominal Value	Unit	Test Method
Flexural Modulus			ASTM D790
22°C	1.77	MPa	ASTM D790
215°C	0.588	MPa	ASTM D790
Flexural Strength			ASTM D790
22°C	0.00834	MPa	ASTM D790
215°C	0.00343	MPa	ASTM D790

Thermal	Nominal Value	Unit	Test Method
Glass Transition Temperature	195	°C	ASTM E1356
CLTE - Flow	1.6E-5	cm/cm/°C	ASTM D696
Thermal Conductivity	0.75	W/m/K	ASTM C177

Electrical	Nominal Value	Unit	Test Method
Volume Resistivity	4.5E+15	ohms·cm	ASTM D257
Dielectric Strength	31	kV/mm	ASTM D149
Dielectric Constant (1 kHz)	3.13		ASTM D150
Dissipation Factor (1 kHz)	1.7E-3		ASTM D150

Flammability	Nominal Value	Unit	Test Method
Flame Rating (3.18 mm)	V-0		UL 94

Additional Information
Recommended Storage Temperature: <5°CLife @ 5°C, defined as not more than 40% loss of spiral flow based on original values.: 24 monthsLife @ 21°C, defined as not more than 40% loss of spiral flow based on original values.: 5 daysLife @ 35°C, defined as not more than 40% loss of spiral flow based on original values.: 2 daysSpiral Flow, 175°C, 1000 psi: 150 cmShimadzu Viscosity, 175°C, 1000 psi: 40 poiseRam Follower Gel Time, 175°C, 1000 psi: 16 secAsh Content: 80 %Hydrolyzable Halides: <1 ppmAlpha Particle Count: <0.0015 counts/cm²/hrCull Hot Hardness, Shore D: 85All test specimens are transfer molded and post cured for 4 hours at 175°C Linear Thermal Expansion, Alpha 1: 16 cm^-6/cm/°C Linear Thermal Expansion, Alpha 2: 55 cm^-6/cm/°C

Additional Information

Recommended Storage Temperature: <5°CLife @ 5°C, defined as not more than 40% loss of spiral flow based on original values.: 24 monthsLife @ 21°C, defined as not more than 40% loss of spiral flow based on original values.: 5 daysLife @ 35°C, defined as not more than 40% loss of spiral flow based on original values.: 2 daysSpiral Flow, 175°C, 1000 psi: 150 cmShimadzu Viscosity, 175°C, 1000 psi: 40 poiseRam Follower Gel Time, 175°C, 1000 psi: 16 secAsh Content: 80 %Hydrolyzable Halides: <1 ppmAlpha Particle Count: <0.0015 counts/cm²/hrCull Hot Hardness, Shore D: 85All test specimens are transfer molded and post cured for 4 hours at 175°C Linear Thermal Expansion, Alpha 1: 16 cm^-6/cm/°C Linear Thermal Expansion, Alpha 2: 55 cm^-6/cm/°C

Injection instructions
Resin Transfer Molding: Molding Temperature: 165 to 170°C Molding Pressure: 500 to 900 psi In Mold Cure Time: 100 to 200 sec Perform Temperature: 80 to 85°C Transfer Time: 6 to 15sec

Category:	Epoxy , Epoxy; Epoxide
Manufacturer:	Cookson Electronics - Semiconductor Products
Trademark:	Plaskon
Fillers:	-
Ports:	Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms	FOB, CIF, DAP, DAT, DDP
PDF:	kKYYGx_Plaskon-MUF-2A-LAR.pdf
PRICE:	Order Products email sales@su-jiao.com

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