EPO-TEK® E4110-LV

Category: Epoxy , Epoxy; Epoxide
Manufacturer: Epoxy Technology Inc.
Trademark: EPO-TEK®
Fillers: -
Ports: Qinzhou, Shekou, Shanghai, Ningbo
Delivery Terms FOB, CIF, DAP, DAT, DDP
PDF: kDUE9p_EPO-TEK-E4110-LV.pdf
PRICE: ​Order Products​ email   sales@su-jiao.com
Wechat: WECHAT
Message
EPO-TEK® E4110-LV is a two component, silver-filled epoxy used in electronic and circuit assembly applications in semiconductor and optical industries. A low viscosity version of EPO-TEK® E4110.

Formerly EP110-LV
General Information
Filler / Reinforcement
  • Silver
Features
  • Electrically Conductive
  • Electromagnetic Shielding (EMI)
  • Low to No Outgassing
  • Low Viscosity
  • Radio Frequency Shielding (RFI)
Uses
  • Adhesives
  • Electrical/Electronic Applications
  • LEDs
  • Optical Applications
  • Printed Circuit Boards
Agency Ratings
  • ASTM E 595
  • EC 1907/2006 (REACH)
  • EU 2003/11/EC
  • EU 2006/122/EC
RoHS Compliance
  • RoHS Compliant
Forms
  • Paste
Processing Method
  • Potting
PhysicalNominal ValueUnit
Ion Type
    Cl- 332ppm
    K+ 0ppm
    Na+ 0ppm
    NH4+ 27ppm
Particle Size < 45.0µm
Additional InformationNominal ValueUnit
Degradation Temperature 365°C
Die Shear Strength - >5 kg (23°C) 11.7MPa
Operating Temperature
    Continuous -55 to 150°C
    Intermittent -55 to 250°C
Storage Modulus 5.44GPa
Thixotropic Index 1.90
Weight Loss on Heating
    200°C 0.33%
    250°C 0.65%
    300°C 1.2%
ThermalNominal ValueUnit
Glass Transition Temperature 1> 40.0°C
CLTE - Flow
    -- 25.0E-5cm/cm/°C
    -- 32.8E-4cm/cm/°C
Thermal Conductivity 1.8W/m/K
ThermosetNominal ValueUnit
Thermoset Components
    Part A Mix Ratio by Weight: 10
    Part B Mix Ratio by Weight: 1.0
Shelf Life (23°C)52wk
Uncured PropertiesNominal ValueUnit
Color
    -- 4Clear/Transparent
    -- 5Silver
Density
    Part B 0.958g/cm³
    Part A 3.09g/cm³
Viscosity 6(23°C)0.35 to 0.85Pa·s
Curing Time (150°C)1.0hr
Pot Life 360min
Cured PropertiesNominal ValueUnit
Shore Hardness (Shore D)60
Lap Shear Strength (23°C)7.45MPa
Volume Resistivity
    23°C < 5.0E-4ohms·cm
    23°C 7< 7.0E-3ohms·cm
Note Message
1 .Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min
2 .Below Tg
3 .Above Tg
4 .Part B
5 .Part A
6 .100 rpm
7 .25°C/40-60%RH/3 Day cure
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