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EPO-TEK® H77S
| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | Epoxy Technology Inc. |
| Trademark: | EPO-TEK® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | ixfozg_EPO-TEK-H77S.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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| A two component, thermally conductive, electrically insulating high-temperature epoxy adhesive. It can be used for high temperature applications within semiconductor packaging including glob top and underfill, hybrid microelectronics, optical, and medical. It is a smaller particle size version of EPO-TEK® H77. |
| General Information | |
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| Features |
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| Uses |
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| Agency Ratings |
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| RoHS Compliance |
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| Forms |
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| Physical | Nominal Value | Unit | |
|---|---|---|---|
| Ion Type | |||
| Cl- | 78 | ppm | |
| K+ | 7 | ppm | |
| Na+ | 12 | ppm | |
| NH4+ | 1 | ppm | |
| Particle Size | < 20.0 | µm |
| Additional Information | Nominal Value | Unit | |
|---|---|---|---|
| Degradation Temperature | 432 | °C | |
| Die Shear Strength - >15 kg (23°C) | 35.2 | MPa | |
| Operating Temperature | |||
| Continuous | -55 to 250 | °C | |
| Intermittent | -55 to 350 | °C | |
| Storage Modulus (23°C) | 3.91 | GPa | |
| Thixotropic Index | 1.20 | ||
| Weight Loss on Heating | |||
| 250°C | 0.060 | % | |
| 300°C | 0.26 | % |
| Thermal | Nominal Value | Unit | |
|---|---|---|---|
| Glass Transition Temperature 1 | > 80.0 | °C | |
| CLTE - Flow | |||
| -- 2 | 3.9E-5 | cm/cm/°C | |
| -- 3 | 9.8E-5 | cm/cm/°C | |
| Thermal Conductivity | 0.67 | W/m/K |
| Thermoset | Nominal Value | Unit | |
|---|---|---|---|
| Thermoset Components | |||
| Part A | Mix Ratio by Weight: 100 | ||
| Part B | Mix Ratio by Weight: 35 | ||
| Shelf Life (23°C) | 52 | wk |
| Uncured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Color | |||
| -- 4 | Amber | ||
| -- 5 | Grey | ||
| Density | |||
| Part B | 1.22 | g/cm³ | |
| Part A | 2.05 | g/cm³ | |
| Viscosity 6(23°C) | 0.95 to 1.5 | Pa·s | |
| Curing Time (150°C) | 1.0 | hr | |
| Pot Life | 480 | min |
| Cured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Shore Hardness (Shore D) | 85 | ||
| Lap Shear Strength (23°C) | 11.3 | MPa | |
| Relative Permittivity (1 kHz) | 4.82 | ||
| Volume Resistivity (23°C) | > 4.0E+11 | ohms·cm | |
| Dissipation Factor (1 kHz) | 0.015 |
| Note Message | |
|---|---|
| 1 . | Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min |
| 2 . | Below Tg |
| 3 . | Above Tg |
| 4 . | Part B |
| 5 . | Part A |
| 6 . | 20 rpm |
| Resin Grade | Manufacturer | Category | Trademark |
|---|---|---|---|
| Tenac™ Z3010 | Asahi Kasei Chemicals Corporation | Acetal (POM) Homopolymer | Tenac™ |
| Cheng Yu PP226 | Cheng Yu Plastic Company Limited | PP, Unspecified | Cheng Yu |
| Evermore PUR SA-215 | Evermore Chemical Industry Co., Ltd. | PUR, Unspecified | Evermore PUR |
| Laticonther 75 GR/50 | LATI S.p.A. | PBT | Laticonther |
| MAJORIS G300 | AD majoris | PP, Unspecified | MAJORIS |
