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LNP™ THERMOCOMP™ QC006 compound
| Category: | Nylon 610 , Polyamide 610 |
| Manufacturer: | SABIC Innovative Plastics |
| Trademark: | LNP™ THERMOCOMP™ |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | iQzk4S_LNPTHERMOCOMPQC006compound.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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| Message |
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LNP THERMOCOMP QC006 is a compound based on Nylon 6/10 resin containing Carbon Fiber. Added features of this material include: Electrically Conductive. Also known as: LNP* THERMOCOMP* Compound QC-1006 Product reorder name: QC006 |
| General Information | |
|---|---|
| Filler / Reinforcement |
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| Features |
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| Physical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Specific Gravity | 1.22 | g/cm³ | ASTM D792 |
| Mechanical | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Tensile Strength (Break) | 236 | MPa | ASTM D638 |
| Flexural Modulus | 18600 | MPa | ASTM D790 |
| Flexural Strength | 393 | MPa | ASTM D790 |
| Impact | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Notched Izod Impact (23°C) | 120 | J/m | ASTM D256 |
| Thermal | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Deflection Temperature Under Load (1.8 MPa, Unannealed, 3.20 mm) | 217 | °C | ASTM D648 |
| Resin Grade | Manufacturer | Category | Trademark |
|---|---|---|---|
| Rilsan® Fine Powders T GREY 5161 MAC | Arkema | Nylon 11 | Rilsan® Fine Powders |
| VESTOLIT® P 1357 K | VESTOLIT GmbH & Co. KG | PVC Homopolymer | VESTOLIT® |
| Electrafil® TPX-PC-02071 | Techmer Engineered Solutions | PC | Electrafil® |
| Electrafil® PC/ABS | Techmer Engineered Solutions | PC+ABS | Electrafil® |
| ELASTOSIL® R plus 4306/70 | Wacker Chemie AG | Silicone | ELASTOSIL® R plus |
