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Durez® 33864
| Category: | Phenolic , Phenolic |
| Manufacturer: | Sumitomo Bakelite North America, Inc. |
| Trademark: | Durez® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | iPDEM7_Durez-33864.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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Durez 33864 is a powdered two-step phenolic resin containing hexamethylenetetramine. Durez 33864 is used as a raw material in making a liquid slurry adhesive. This adhesive is used to glue together foundry shell molds.
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| General Information | |
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| Thermoset | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Post Cure Time (150°C) | 23 | hr |
| Additional Information | Nominal Value | Unit | Test Method |
|---|---|---|---|
| Hexa | 13 | % | Internal Method |
| Inclined Plate Flow (125°C) | 3.50 | cm | Internal Method |
| Screen Mesh 1 | < 2.0 | % | Internal Method |
| Note Message | |
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| 1 . | 200 Mesh |
| Resin Grade | Manufacturer | Category | Trademark |
|---|---|---|---|
| RTP 300 TC-C-20 | RTP Company | PC | RTP |
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| LNP™ THERMOTUF™ W1000I compound | SABIC Innovative Plastics Europe | PBT | LNP™ THERMOTUF™ |
| Plaslube® PA6/6 CF20 TS15 BK | Techmer Engineered Solutions | Nylon 66 | Plaslube® |
