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EPO-TEK® H61-110
| Category: | Epoxy , Epoxy; Epoxide |
| Manufacturer: | Epoxy Technology Inc. |
| Trademark: | EPO-TEK® |
| Fillers: | - |
| Ports: | Qinzhou, Shekou, Shanghai, Ningbo |
| Delivery Terms | FOB, CIF, DAP, DAT, DDP |
| PDF: | hvvFxD_EPO-TEK-H61-110.pdf  |
| PRICE: | Order Products email sales@su-jiao.com |
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| A single component, high Tg, electrically insulating epoxy adhesive for semiconductor, microelectronic, and opto-electronic packaging applications. It is a liquid version of EPO-TEK® H61. |
| General Information | |
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| Features |
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| Uses |
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| Agency Ratings |
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| RoHS Compliance |
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| Forms |
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| Physical | Nominal Value | Unit | |
|---|---|---|---|
| Ion Type | |||
| Cl- | 12 | ppm | |
| K+ | 15 | ppm | |
| Na+ | 275 | ppm |
| Additional Information | Nominal Value | Unit | |
|---|---|---|---|
| Degradation Temperature | 420 | °C | |
| Die Shear Strength - >15 kg (23°C) | 35.2 | MPa | |
| Operating Temperature | |||
| Continuous | -55 to 200 | °C | |
| Intermittent | -55 to 300 | °C | |
| Storage Modulus | 2.00 | GPa | |
| Weight Loss on Heating | |||
| 200°C | 0.38 | % | |
| 250°C | 0.64 | % | |
| 300°C | 0.84 | % |
| Thermal | Nominal Value | Unit | |
|---|---|---|---|
| Glass Transition Temperature 1 | > 110 | °C | |
| CLTE - Flow | |||
| -- 2 | 4.9E-5 | cm/cm/°C | |
| -- 3 | 1.5E-4 | cm/cm/°C |
| Optical | Nominal Value | ||
|---|---|---|---|
| Refractive Index 4 | 1.546 |
| Thermoset | Nominal Value | Unit | |
|---|---|---|---|
| Shelf Life 5 | 26 | wk |
| Uncured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Color | Transparent, Light Yellow | ||
| Density | 1.22 | g/cm³ | |
| Viscosity 6(23°C) | 2.0 to 4.0 | Pa·s | |
| Curing Time (150°C) | 1.0 | hr | |
| Pot Life | 40000 | min |
| Cured Properties | Nominal Value | Unit | |
|---|---|---|---|
| Shore Hardness (Shore D) | 83 | ||
| Lap Shear Strength (23°C) | 5.23 | MPa | |
| Relative Permittivity (1 kHz) | 3.63 | ||
| Volume Resistivity (23°C) | > 1.0E+13 | ohms·cm | |
| Dissipation Factor (1 kHz) | 7.0E-3 |
| Note Message | |
|---|---|
| 1 . | Dynamic Cure 20-200°C/ISO 25 Min; Ramp -10-200°C @ 20°C/Min |
| 2 . | Below Tg |
| 3 . | Above Tg |
| 4 . | 589 nm |
| 5 . | Refrigerated |
| 6 . | 100 rpm |
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|---|---|---|---|
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| Celstran® PA6-GF50-01 | Celanese Corporation | Nylon 6 | Celstran® |
| Grilamid® XE 4105 nat | EMS-GRIVORY | Nylon 610 | Grilamid® |
| Plaslube® ABS/PBT 1500 | Techmer Engineered Solutions | ABS+PBT | Plaslube® |
